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TLK4201EARGTT

Texas Instruments

TLK4201EARGTT by Texas Instruments

TLK4201EARGTT by Texas Instruments is a 16-terminal telecom IC with 3.3V supply voltage and 4250 Mbps data rate. It operates in industrial temperature range (-40 to 85 °C) and has a compact square package suitable for surface mount applications. The IC features nickel palladium gold terminal finish, making it ideal for high-speed telecommunications circuits.

Median Price

$11.842

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,500 parts In-Stock

1+ parts

$10.559

100+ parts

$9.223

1k+ parts

$6.361

10k+ parts

-

15,500

$10.559

$9.223

$6.361

-

Rochester

USA . 5,250 parts In-Stock

1+ parts

-

100+ parts

$10.500

1k+ parts

$9.390

10k+ parts

$8.840

5,250

-

$10.500

$9.390

$8.840

DigiKey

USA . 5,250 parts In-Stock

1+ parts

-

100+ parts

$13.810

1k+ parts

-

10k+ parts

-

5,250

-

$13.810

-

-

Verical

USA . 5,250 parts In-Stock

1+ parts

-

100+ parts

$13.125

1k+ parts

$11.738

10k+ parts

-

5,250

-

$13.125

$11.738

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,653 parts In-Stock

1+ parts

$9.180

100+ parts

-

1k+ parts

-

10k+ parts

-

3,653

$9.180

-

-

-

Digiode

USA . 910 parts In-Stock

1+ parts

$9.633

100+ parts

-

1k+ parts

-

10k+ parts

-

910

$9.633

-

-

-

DigiKey Marketplace

USA . 5,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,250

-

-

-

-

Cyclops Electronics Ltd

UK . 2,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,250

-

-

-

-

Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 121 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

121

-

-

-

-

Speed Components Ltd

Israel . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,332 parts In-Stock

1+ parts

$5.595

100+ parts

-

1k+ parts

$6.387

10k+ parts

-

2,332

$5.595

-

$6.387

-

ChromeModa Solutions

Germany . 6,020 parts In-Stock

1+ parts

$6.287

100+ parts

$5.155

1k+ parts

-

10k+ parts

-

6,020

$6.287

$5.155

-

-

IDEA Electronic Components Group

UK . 161 parts In-Stock

1+ parts

$6.287

100+ parts

-

1k+ parts

$5.658

10k+ parts

-

161

$6.287

-

$5.658

-

Corphita

USA . 4,967 parts In-Stock

1+ parts

$9.126

100+ parts

-

1k+ parts

-

10k+ parts

-

4,967

$9.126

-

-

-

Component Stockers USA

USA . 7,317 parts In-Stock

1+ parts

$9.130

100+ parts

$8.580

1k+ parts

$7.770

10k+ parts

-

7,317

$9.130

$8.580

$7.770

-

A-Z Elektronik GmbH

Germany . 6,447 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,447

-

-

-

-

S.R.D Solutions

India . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

DigiPath Technology Company

USA . 1,311 parts In-Stock

1+ parts

-

100+ parts

$5.668

1k+ parts

-

10k+ parts

-

1,311

-

$5.668

-

-

Overview

Unlock the potential of your telecommunications projects with the TLK4201EARGTT by Texas Instruments. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. From high-speed data transmission to seamless connectivity, this product delivers superior performance in a compact and efficient package. Trust in Texas Instruments to provide innovative solutions for all your telecom interface needs. Elevate your projects with the TLK4201EARGTT and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

The surface mount feature allows for easy and secure integration onto circuit boards, saving space and making assembly more efficient.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with a wide range of electronic systems and reduces the need for additional voltage regulation components.

No. of Terminals: 16

The 16 terminals provide ample connectivity options for interfacing with other components or devices, enhancing versatility and functionality.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product is reliable and can withstand higher temperature environments, making it suitable for industrial applications.

Width: 3 mm

The compact width of 3mm allows for space-saving installation and integration into tight or limited areas.

Data Rate: 4250 Mbps

The high data rate of 4250 Mbps ensures fast and efficient data transmission, making this product suitable for high-speed telecom applications.

Technical Specifications

Other Function Telecom Interface ICs TLK4201EARGTT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

4250 Mbps

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.038 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TLK4201EARGTT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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