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TLK4211EARGTRG4

Texas Instruments

TLK4211EARGTRG4 by Texas Instruments

TLK4211EARGTRG4 by Texas Instruments is a 16-terminal telecom IC with 3.3V supply voltage, suitable for industrial applications. It features a max operating temperature of 85°C and low supply current of 0.038mA. This surface-mount chip carrier is designed for telecom circuits in a compact square package shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,256 parts In-Stock

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Digiode

USA . 3,759 parts In-Stock

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3,759

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Distributors (Availability)

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AZTECH Wire

Italy . 495 parts In-Stock

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$8.651

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495

$8.651

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Parana Technologies

USA . 2,158 parts In-Stock

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$13.746

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$14.235

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$13.746

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$14.235

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DigiPath Technology Company

USA . 74 parts In-Stock

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$15.136

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$13.925

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74

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$13.925

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ChromeModa Solutions

Germany . 3,931 parts In-Stock

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$15.445

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$12.665

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3,931

$15.445

$12.665

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IDEA Electronic Components Group

UK . 375 parts In-Stock

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$15.445

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$14.673

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$13.900

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375

$15.445

$14.673

$13.900

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One Stop Electronics

USA . 1,289 parts In-Stock

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$283.000

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Corphita

USA . 901 parts In-Stock

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Microchip USA

USA . 338 parts In-Stock

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Overview

Elevate your telecom interface systems with the TLK4211EARGTRG4 by Texas Instruments. Designed with precision and expertise, this product offers exceptional quality and reliability. Perfect for a wide range of applications in the telecommunications industry, this IC delivers unparalleled performance and efficiency. Trust in Texas Instruments to provide cutting-edge solutions that enhance your systems while optimizing functionality. Upgrade your telecom interface with the TLK4211EARGTRG4 and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the IC, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Package Shape: SQUARE

The square package shape helps in optimizing space utilization on circuit boards, especially in applications where space is limited.

Power Supplies (V): 3.3

Operating at a low power supply voltage of 3.3V makes the IC energy-efficient and suitable for a wide range of applications where power consumption is a concern.

No. of Terminals: 16

Having 16 terminals provides flexibility in connecting to other components, allowing for versatile integration into various telecommunications systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile in the package style ensures efficient heat dissipation and space-saving design, enhancing the overall performance of the IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the IC can withstand harsh environmental conditions and maintain reliable performance in demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the IC to function effectively in extreme cold environments, expanding its usability in a variety of conditions.

Terminal Position: QUAD

The quad terminal position offers improved stability and connectivity, ensuring secure connections and reducing the risk of signal interference or loss.

Maximum Seated Height: 1 mm

The maximum seated height of 1mm enables a compact and space-efficient design, making it suitable for applications where height restrictions are a concern.

Width: 3 mm

The narrow width of 3mm allows for efficient utilization of board space and easy integration into various electronic devices and systems.

Length: 3 mm

The compact length of 3mm further contributes to space-saving and compact design requirements, ideal for applications where size constraints are a consideration.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in a wide range of temperature conditions, making the IC suitable for industrial applications with varying temperature requirements.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joints cracking or failing, enhancing the durability and reliability of the IC in demanding operating environments.

Maximum Supply Current: 0.038 mA

Operating at a low maximum supply current of 0.038mA helps in conserving energy and minimizing power consumption, making it an energy-efficient solution for telecom interface applications.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this IC ensures optimized performance and compatibility with telecommunications systems, making it a reliable choice for telecom interface applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with standard power supply voltages in telecommunication systems, simplifying integration and operation in telecom applications.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, the IC allows for precise and compact placement of terminals on the circuit board, enhancing connectivity and signal transmission efficiency in telecom applications.

Technical Specifications

Other Function Telecom Interface ICs TLK4211EARGTRG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N16

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.038 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

TLK4211EARGTRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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