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TLK4211EARGTTG4

Texas Instruments

TLK4211EARGTTG4 by Texas Instruments

TLK4211EARGTTG4 by Texas Instruments is a telecom IC with 16 terminals, operating at 3.3V. It has a temperature range of -40 to 85°C and features nickel palladium gold terminal finish. This chip carrier package is suitable for industrial applications requiring very thin profile components.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,614 parts In-Stock

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Vyrian

USA . 2,567 parts In-Stock

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2,567

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Distributors (Availability)

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AZTECH Wire

Italy . 599 parts In-Stock

1+ parts

$7.287

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599

$7.287

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Parana Technologies

USA . 489 parts In-Stock

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$9.871

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$10.443

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489

$9.871

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$10.443

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DigiPath Technology Company

USA . 2,092 parts In-Stock

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$10.869

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$10.000

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2,092

$10.869

$10.000

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ChromeModa Solutions

Germany . 2,100 parts In-Stock

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$11.091

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$9.095

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$11.091

$9.095

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IDEA Electronic Components Group

UK . 1,417 parts In-Stock

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$11.091

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$10.536

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$9.982

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1,417

$11.091

$10.536

$9.982

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Semicontronic

India . 683 parts In-Stock

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$254.000

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$247.650

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$246.380

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683

$254.000

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$246.380

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Ampacity Inc.

Singapore . 162 parts In-Stock

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$465.000

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One Stop Electronics

USA . 716 parts In-Stock

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$828.000

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Corphita

USA . 3,495 parts In-Stock

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3,495

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Corohmni

South Africa . 378 parts In-Stock

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Overview

Experience seamless communication with the TLK4211EARGTTG4 by Texas Instruments. This top-quality telecom interface IC, designed with precision and expertise, offers unparalleled reliability and performance. Ideal for a wide range of applications, this versatile chip carrier with a very thin profile ensures optimal functionality in industrial settings. With a nominal supply voltage of 3.3V and low supply current, this advanced telecom circuit guarantees efficiency and cost-effectiveness. Trust Texas Instruments to deliver cutting-edge solutions that exceed your expectations. Elevate your communication systems with the TLK4211EARGTTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Power Supplies (V): 3.3

Operating at 3.3V provides a standard power supply requirement, compatible with many common systems and designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package style offers efficient heat dissipation and compact size for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can function reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at -40°C ensures functionality even in extreme cold environments, increasing the versatility of this IC.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, enhancing the performance and longevity of the IC.

Terminal Position: QUAD

Quad terminal position offers secure connections and helps optimize signal transmission, improving reliability and performance.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for a compact design, particularly beneficial for applications with limited vertical space.

Width: 3 mm

The narrow width of 3mm facilitates installation in tight spaces and allows for efficient use of board real estate.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, this IC can withstand manufacturing processes involving soldering, ensuring reliability during assembly.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC meets the required standards for reliability and performance in demanding environments.

Maximum Supply Current: 0.038 mA

The low maximum supply current of 0.038 mA helps minimize power consumption, making this IC energy efficient and suitable for battery-powered devices.

Moisture Sensitivity Level (MSL): 2

Having a moisture sensitivity level of 2 indicates that this IC can withstand standard factory handling and storage conditions, ensuring product integrity.

Technical Specifications

Other Function Telecom Interface ICs TLK4211EARGTTG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.038 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TLK4211EARGTTG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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