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TLK4211EARGTR

Texas Instruments

TLK4211EARGTR by Texas Instruments

TLK4211EARGTR by Texas Instruments is a 16-terminal telecom IC with 3.3V supply voltage, suitable for industrial applications. It features a max operating temperature of 85°C and low supply current of 0.038mA, making it ideal for telecom circuit designs requiring high reliability in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 6,419 parts In-Stock

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Chip Stock

USA . 4,953 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,453 parts In-Stock

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Digiode

USA . 2,607 parts In-Stock

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AZTECH Wire

Italy . 753 parts In-Stock

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$11.608

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753

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Parana Technologies

USA . 2,179 parts In-Stock

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$13.205

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$13.711

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DigiPath Technology Company

USA . 1,242 parts In-Stock

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$14.540

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ChromeModa Solutions

Germany . 4,733 parts In-Stock

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$14.837

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$12.166

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IDEA Electronic Components Group

UK . 1,208 parts In-Stock

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$14.837

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$14.095

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$13.353

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Component Stockers USA

USA . 720 parts In-Stock

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$99.990

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One Stop Electronics

USA . 826 parts In-Stock

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$299.000

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A-Z Elektronik GmbH

Germany . 5,618 parts In-Stock

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S.R.D Solutions

India . 2,713 parts In-Stock

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Corphita

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Microchip USA

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Overview

Enhance your telecommunications system with the TLK4211EARGTR by Texas Instruments, a top-quality telecom interface IC that guarantees seamless connectivity and reliability. Manufactured by the industry leader, Texas Instruments, this chip carrier boasts a very thin profile and a temperature grade suitable for industrial applications. With its low supply current and nominal voltage of 3.3V, this product offers unparalleled value and benefits to customers looking to optimize their telecom systems. Upgrade your setup today and experience the superior performance of the TLK4211EARGTR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for telecom applications where weight and longevity are important factors.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Power Supplies (V): 3.3

With a power supply of 3.3V, the product is compatible with a wide range of systems and can operate efficiently within this voltage range.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the product can withstand elevated temperatures without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function effectively even in harsh cold environments.

Maximum Supply Current: 0.038 mA

The low maximum supply current helps in reducing power consumption, making the product energy-efficient and cost-effective in the long run.

Technical Specifications

Other Function Telecom Interface ICs TLK4211EARGTR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N16

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.038 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

TLK4211EARGTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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