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TLC320AD545PTRG4

Texas Instruments

TLC320AD545PTRG4 by Texas Instruments

TLC320AD545PTRG4 by Texas Instruments is a telecom interface IC with 48 terminals, operating at 3.3/5V. It features two's complement output/input codes and offers a resolution of 16um. Ideal for telecom circuits, this IC has a temperature range of 0-70°C and comes in a flatpack package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,431 parts In-Stock

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8,431

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Sea View Technologies

USA . 592 parts In-Stock

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592

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Bristol Electronics

USA . 592 parts In-Stock

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592

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Digiode

USA . 545 parts In-Stock

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545

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,040 parts In-Stock

1+ parts

$6.497

100+ parts

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1k+ parts

$7.242

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2,040

$6.497

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$7.242

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AZTECH Wire

Italy . 862 parts In-Stock

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$6.922

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862

$6.922

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DigiPath Technology Company

USA . 1,318 parts In-Stock

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$7.154

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$6.582

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1,318

$7.154

$6.582

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ChromeModa Solutions

Germany . 4,715 parts In-Stock

1+ parts

$7.300

100+ parts

$5.986

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4,715

$7.300

$5.986

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IDEA Electronic Components Group

UK . 601 parts In-Stock

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$7.300

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$6.570

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601

$7.300

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$6.570

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One Stop Electronics

USA . 378 parts In-Stock

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$518.000

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378

$518.000

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Corphita

USA . 1,116 parts In-Stock

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Overview

Experience seamless connectivity and exceptional performance with the TLC320AD545PTRG4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that guarantee reliability and innovation. This telecom interface IC is perfect for various applications, offering customers unmatched value and benefits. Trust in Texas Instruments to provide you with cutting-edge solutions that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body helps in reducing the overall weight of the product, making it more convenient for transportation and installation.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Output Code: TWOS COMPLEMENT

The output code being in two's complement form ensures accurate representation of negative numbers, enhancing the overall functionality of the product.

Package Shape: SQUARE

The square package shape helps in optimizing PCB layout and space utilization, making it ideal for compact electronic designs.

Input Code: TWOS COMPLEMENT

With input code also in two's complement form, the compatibility and consistency between input and output data are ensured for seamless operation.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages (3.3V and 5V) provides flexibility in operating the product in different environments and applications.

No. of Terminals: 48

Having 48 terminals allows for a greater number of connectivity options, enabling versatile integration with other components or systems.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enhances the product's thermal performance, electrical characteristics, and compatibility with modern PCB technologies.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C guarantees operation in a wide range of temperature settings, making it suitable for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent corrosion resistance and ensures long-term reliability of the product in different operating conditions.

Maximum Output Voltage: 3 V

The maximum output voltage of 3V meets the requirements of many telecom interfaces, ensuring compatibility and smooth data transmission.

Terminal Position: QUAD

The quad terminal configuration simplifies the connection process and improves signal integrity, contributing to the product's overall performance.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm facilitates space-saving installation, especially in constrained areas or compact devices.

Width: 7 mm

The 7mm width of the product offers a balanced form factor for easy integration into existing systems or electronic setups.

Maximum Analog Input: 3 V

Support for a maximum analog input of 3V ensures compatibility with a wide range of signal sources and enhances the product's versatility.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper solder reflow during assembly, maintaining strong and reliable connections.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables robust soldering of the product during manufacturing, guaranteeing stable electrical connections.

Length: 7 mm

The 7mm length of the product contributes to its compact design, making it suitable for applications where space is limited.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that the product meets industry standards for regular commercial use, providing reliability and consistent performance.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical strength and ease of soldering during assembly, enhancing the overall durability of the product.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom circuits, this product offers advanced features and functionalities tailored to meet the requirements of telecommunication applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures consistent and stable power delivery, contributing to the overall reliability and performance of the product.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5mm allows for high-density mounting of the product on PCBs, enabling efficient use of space and enhanced electrical connectivity.

Resolution (um): 16

The resolution of 16 micrometers provides high precision in signal processing and data conversion, ensuring accurate and reliable performance in telecom applications.

Input Type: DIFFERENTIAL

Support for differential input type enhances noise immunity and signal integrity, making the product suitable for high-performance telecom systems where data accuracy is crucial.

Technical Specifications

Other Function Telecom Interface ICs TLC320AD545PTRG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Maximum Analog Input:

3 V

Input Code:

TWOS COMPLEMENT

Input Type:

DIFFERENTIAL

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Code:

TWOS COMPLEMENT

Maximum Output Voltage:

3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Resolution (um):

16

Maximum Seated Height:

1.6 mm

Sub-Category:

Codecs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TLC320AD545PTRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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