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TLC320AD545PTG4

Texas Instruments

TLC320AD545PTG4 by Texas Instruments

TLC320AD545PTG4 by Texas Instruments is a 48-terminal telecom IC with 16um resolution, operating at 3.3V. It features two's complement output/input codes and supports differential input type. Ideal for telecom circuits, it has a low-profile flatpack package style suitable for commercial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,830 parts In-Stock

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5,830

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Digiode

USA . 1,406 parts In-Stock

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1,406

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Distributors (Availability)

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AZTECH Wire

Italy . 679 parts In-Stock

1+ parts

$7.187

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679

$7.187

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Parana Technologies

USA . 2,023 parts In-Stock

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$9.422

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$10.041

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2,023

$9.422

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$10.041

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DigiPath Technology Company

USA . 2,239 parts In-Stock

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$10.374

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$9.544

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2,239

$10.374

$9.544

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ChromeModa Solutions

Germany . 1,732 parts In-Stock

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$10.586

100+ parts

$8.681

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1,732

$10.586

$8.681

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IDEA Electronic Components Group

UK . 1,126 parts In-Stock

1+ parts

$10.586

100+ parts

$10.057

1k+ parts

$9.527

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1,126

$10.586

$10.057

$9.527

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One Stop Electronics

USA . 1,105 parts In-Stock

1+ parts

$372.000

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1,105

$372.000

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Corphita

USA . 3,311 parts In-Stock

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3,311

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Microchip USA

USA . 232 parts In-Stock

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Overview

Unlock the potential of your telecom applications with the TLC320AD545PTG4 by Texas Instruments. Crafted with precision and expertise, this innovative telecom interface IC offers unparalleled quality and reliability. From seamless two's complement output coding to a wide range of power supply options, this product is designed to exceed expectations. Whether you're looking to enhance communication systems or optimize data transmission, the TLC320AD545PTG4 delivers exceptional performance and value. Trust Texas Instruments for cutting-edge solutions that propel your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting telecom devices.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort during manufacturing.

Output Code: TWOS COMPLEMENT

The use of twos complement output code ensures accurate representation of negative numbers, improving the overall reliability of the telecom interface.

Input Code: TWOS COMPLEMENT

Matching the input and output code as twos complement ensures seamless compatibility and data consistency within the interface circuitry.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages (3.3V and 5V) provides flexibility in design and compatibility with various system configurations.

No. of Terminals: 48

The abundance of terminals allows for comprehensive connectivity options and enhanced functionality within the telecom interface IC.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style ensures efficient use of space on circuit boards, enabling compact and sleek telecom device designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the telecom interface IC can perform reliably in various environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C enhances the product's versatility and usability in different temperature settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures excellent conductivity, corrosion resistance, and longevity of the telecom interface IC.

Terminal Position: QUAD

The quad terminal position facilitates easy and secure connection to external devices, promoting stable signal transmission and performance.

Maximum Seated Height: 1.6 mm

The low seated height of 1.6mm contributes to a compact overall product profile, suitable for space-constrained telecom device designs.

Width: 7 mm

The 7mm width of the telecom interface IC allows for efficient utilization of board space, enabling streamlined integration into electronic systems.

Maximum Analog Input: 3 V

With support for up to 3V analog input, the telecom interface IC can accommodate a wide range of signal levels for enhanced flexibility in telecom applications.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature of 260°C ensures proper soldering and reliability during manufacturing processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C facilitates efficient soldering and assembly of the telecom interface IC onto circuit boards.

Length: 7 mm

The 7mm length of the telecom interface IC contributes to a compact form factor, making it suitable for miniaturized telecom devices.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures compatibility with standard operating conditions, making the telecom interface IC suitable for commercial telecom applications.

Terminal Form: GULL WING

The gull wing terminal form offers reliable solder joints and mechanical stability, enhancing the overall durability and performance of the telecom interface IC.

Telecom IC Type: TELECOM CIRCUIT

As a specialized telecom circuit interface IC, this product is tailored for telecommunications applications, ensuring optimized performance and compatibility in telecom systems.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage provides a stable power source for the telecom interface IC, ensuring consistent and reliable operation in telecom devices.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for fine-pitch soldering, enabling precise connections and compact design layouts for efficient telecom device integration.

Resolution (um): 16

With a resolution of 16 microns, the telecom interface IC can accurately process and interpret signals with high precision, ensuring reliable data communication in telecom systems.

Input Type: DIFFERENTIAL

Support for differential input type enables noise rejection and signal integrity in data transmission, making the telecom interface IC ideal for demanding telecom environments.

Technical Specifications

Other Function Telecom Interface ICs TLC320AD545PTG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Maximum Analog Input:

3 V

Input Code:

TWOS COMPLEMENT

Input Type:

DIFFERENTIAL

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Code:

TWOS COMPLEMENT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Resolution (um):

16

Maximum Seated Height:

1.6 mm

Sub-Category:

Codecs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TLC320AD545PTG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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