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TL16C752BPTG4

Texas Instruments

TL16C752BPTG4 by Texas Instruments

TL16C752BPTG4 by Texas Instruments is a Serial Communication Controller with 48 terminals, operating at 3.3V. It supports data transfer rates up to 0.375 MBps and operates in industrial temperature range of -40 to 85 °C. Ideal for applications requiring low power consumption and high-speed asynchronous communication protocols.

Median Price

$18.551

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Freelance Electronics

USA . 4 parts In-Stock

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Chip Stock

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Digiode

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Vyrian

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ComSIT Distribution GmbH

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LIBRA Elektronik GmbH

Germany . 63 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Classic Components Corporation

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Bristol Electronics

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LWI Electronics Inc

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Electronics Depot

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Connector Distribution Corp

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Right Parts Inc.

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,181 parts In-Stock

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$4.000

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AZTECH Wire

Italy . 347 parts In-Stock

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Parana Technologies

USA . 903 parts In-Stock

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$22.400

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$23.074

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$22.400

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DigiPath Technology Company

USA . 876 parts In-Stock

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$24.665

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$22.691

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ChromeModa Solutions

Germany . 2,275 parts In-Stock

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IDEA Electronic Components Group

UK . 1,122 parts In-Stock

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One Stop Electronics

USA . 848 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Corphita

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Microchip USA

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Bastille Electronics

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Overview

Enhance your communication systems with the Texas Instruments TL16C752BPTG4, a high-quality Serial Communication Controller designed for reliable data transfer. Manufactured by Texas Instruments, known for their superior products, this controller offers seamless connectivity and efficient performance in various applications. With a wide range of features and benefits, including low power mode and high clock frequency, this product provides exceptional value and advantages to customers looking to optimize their serial communication processes. Upgrade your systems today with the TL16C752BPTG4 and experience enhanced efficiency and reliability like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and light weight to the product, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this product can accommodate a wide range of voltage inputs, making it versatile and compatible with different systems.

Address Bus Width: 3

A 3-bit address bus width allows for efficient communication and addressing within the system, enhancing overall performance.

Package Shape: SQUARE

The square package shape offers a compact design, saving space on the PCB and enabling integration into smaller devices.

Power Supplies (V): 3.3

The power supply of 3.3V ensures stable and efficient operation of the product, making it reliable for long-term use.

No. of Terminals: 48

With 48 terminals, this product offers ample connectivity options, allowing for versatile configurations and connectivity with other devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style facilitates easy integration into compact designs, ideal for space-constrained applications.

Minimum Supply Voltage: 2.7 V

The minimum supply voltage of 2.7V ensures that the product can operate in low-power scenarios, making it energy-efficient and cost-effective.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperatures, making it suitable for industrial environments.

Maximum Data Transfer Rate: 0.375 MBps

The high data transfer rate of 0.375 MBps ensures fast and efficient communication, making this product ideal for high-speed applications.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C allows the product to function in extreme cold conditions, expanding its usability in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides superior conductivity and corrosion resistance, ensuring reliable connections for long-lasting performance.

Terminal Position: QUAD

The quad terminal position allows for easy connectivity and efficient signal routing, enhancing the overall functionality of the product.

Maximum Seated Height: 1.6 mm

The maximum seated height of 1.6mm offers a low-profile design, making it suitable for compact devices and space-saving applications.

Technical Specifications

Serial Communication Controllers TL16C752BPTG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

48 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.375 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TL16C752BPTG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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