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TL16C550CPTRG4

Texas Instruments

TL16C550CPTRG4 by Texas Instruments

TL16C550CPTRG4 by Texas Instruments is a Serial Communication Controller with 48 terminals, operating at 0-70°C. It supports data rates up to 0.125 MBps and has a max clock frequency of 16 MHz. Ideal for applications requiring asynchronous communication protocols and low-profile packaging in commercial-grade environments.

Median Price

$6.890

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 562 parts In-Stock

1+ parts

$6.890

100+ parts

$4.150

1k+ parts

$2.670

10k+ parts

$2.580

562

$6.890

$4.150

$2.670

$2.580

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,791 parts In-Stock

1+ parts

$6.023

100+ parts

-

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4,791

$6.023

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Vyrian

USA . 5,297 parts In-Stock

1+ parts

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5,297

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Chip Stock

USA . 4,692 parts In-Stock

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4,692

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,292 parts In-Stock

1+ parts

$5.706

100+ parts

-

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2,292

$5.706

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Parana Technologies

USA . 163 parts In-Stock

1+ parts

$63.590

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163

$63.590

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DigiPath Technology Company

USA . 223 parts In-Stock

1+ parts

$70.021

100+ parts

$64.419

1k+ parts

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223

$70.021

$64.419

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ChromeModa Solutions

Germany . 3,963 parts In-Stock

1+ parts

$71.450

100+ parts

$58.589

1k+ parts

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3,963

$71.450

$58.589

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IDEA Electronic Components Group

UK . 1,748 parts In-Stock

1+ parts

$71.450

100+ parts

$67.878

1k+ parts

$64.305

10k+ parts

-

1,748

$71.450

$67.878

$64.305

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A-Z Elektronik GmbH

Germany . 7,481 parts In-Stock

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7,481

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Microchip USA

USA . 2,346 parts In-Stock

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Assy Fe

Spain . 8 parts In-Stock

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8

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Overview

Enhance your communication systems with the TL16C550CPTRG4 by Texas Instruments, a top-notch Serial Communication Controller designed to elevate your projects to new heights. Crafted with precision and expertise, Texas Instruments ensures unrivaled quality and reliability in every component. Ideal for a wide range of applications, this controller offers seamless data transfer rates and efficient performance. Unlock the endless possibilities of connectivity and communication with this cutting-edge product that guarantees value, benefits, and advantages for all your needs. Elevate your projects with the TL16C550CPTRG4 and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easier assembly, space-saving design, and improved reliability compared to through-hole mounting.

Maximum Supply Voltage: 5.25 V

This high maximum supply voltage allows for flexibility in the power source, making the product compatible with a variety of systems.

Address Bus Width: 3

A wider address bus allows for greater memory addressing capabilities and better performance in data communication.

Package Shape: SQUARE

The square package shape ensures efficient use of space on the circuit board, enabling a more compact design.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages provides compatibility with different systems and allows for versatility in application.

No. of Terminals: 48

Having a higher number of terminals allows for greater connectivity options and compatibility with various external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact footprint, low profile for space-saving design, and fine pitch for high density integration, making it ideal for modern electronic devices.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures efficient power consumption and reliable operation even under low voltage conditions.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for reliable performance in temperature-challenging environments or applications.

Maximum Data Transfer Rate: 0.125 MBps

The high data transfer rate enables quick and efficient communication, making the product suitable for high-speed data transmission.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the device can function in a wide range of temperature environments, both hot and cold.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity, corrosion resistance, and durability, ensuring long-term reliability of the product.

Terminal Position: QUAD

The quad terminal position allows for more stable and secure connections, reducing the risk of signal loss or interference.

Maximum Seated Height: 1.6 mm

The low seated height is ideal for applications where space is limited or a slim profile is required, enabling versatile design options.

Width: 7 mm

The narrow width offers space-saving benefits and compatibility with compact electronic devices or circuit board layouts.

Data Encoding or Decoding Method: NRZ

Using a non-return-to-zero (NRZ) data encoding method ensures reliable and efficient data transmission, suitable for various communication protocols.

External Data Bus Width: 8

A wider external data bus width allows for faster data transfer and improved performance in handling data communication tasks.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication protocol and bit-level data transfer enhances interoperability with different devices and systems.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency enables fast data processing and communication, making the product suitable for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering and assembly processes during manufacturing.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product is compatible with standard surface mount reflow soldering processes, ensuring proper solder joint formation.

Length: 7 mm

The compact length of the product offers space-saving benefits and compatibility with small form factor designs, ideal for compact electronic devices.

Temperature Grade: COMMERCIAL

Designed for commercial temperature range, ensuring reliable performance in typical operating conditions found in commercial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

This product serves as a versatile serial I/O and communication controller, facilitating data communication and interfacing with various peripherals.

Technology: MOS

Utilizing MOS technology offers low power consumption, high speed operation, and compatibility with a wide range of applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and easy assembly, ensuring reliable performance and durability during operation.

Maximum Supply Current: 10 mA

The low maximum supply current contributes to efficient power usage and compatibility with systems requiring low power consumption.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard voltage levels, making the product widely applicable in various systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density integration and space-saving design, ideal for compact electronic devices or PCB layouts.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that the product can withstand standard moisture exposure levels during manufacturing and storage, ensuring product reliability.

Technical Specifications

Serial Communication Controllers TL16C550CPTRG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY AT 14.9 MHZ

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

16 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

0

No. of Serial I/Os:

1

No. of Terminals:

48

On Chip Data RAM Width:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TL16C550CPTRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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