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TL16C452FN

Texas Instruments

TL16C452FN by Texas Instruments

TL16C452FN by Texas Instruments is a Serial Communication Controller with 5V supply, 0-70°C operating temp, and 0.03125 MBps data transfer rate. It is used for asynchronous communication in IBM PC-AT systems, featuring 68 terminals and J Bend terminal form.

Median Price

$8.488

Lifecycle Status

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38

In-Stock Inventory

1k+

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Chip1Stop

Japan . 89 parts In-Stock

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RS (Exports)

UK . 49 parts In-Stock

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Mouser Electronics

USA . 118 parts In-Stock

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DigiKey

USA . 4 parts In-Stock

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Rochester

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Verical

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Arrow

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Digiode

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Forefront Electronics and Design

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DigiKey Marketplace

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Manoshevitz Elec. Sales

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Component Sense

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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First Choice Components Inc.

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J & M Industries LLC

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Semicontronic

India . 3,375 parts In-Stock

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$4.310

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$4.202

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$4.181

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Ampacity Inc.

Singapore . 3,067 parts In-Stock

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Corphita

USA . 3,429 parts In-Stock

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Parana Technologies

USA . 1,427 parts In-Stock

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DigiPath Technology Company

USA . 749 parts In-Stock

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$22.280

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ChromeModa Solutions

Germany . 4,167 parts In-Stock

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IDEA Electronic Components Group

UK . 2,076 parts In-Stock

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Modulus Dynamics

Lithuania . 1,213 parts In-Stock

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Corohmni

South Africa . 415 parts In-Stock

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Continental Prestige Electronics

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Perfect Parts

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GreenTree Electronics

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Overview

Unlock seamless communication solutions with the TL16C452FN by Texas Instruments. Crafted with precision and expertise, this serial communication controller offers unparalleled quality and reliability. Ideal for a variety of applications, this product provides customers with unmatched value and benefits. Experience enhanced data transfer rates and efficient communication protocols, making it a must-have for all your connectivity needs. Trust in Texas Instruments to deliver innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product easy to handle and transport.

Maximum Supply Voltage: 5.25 V

Provides a wide voltage range to ensure stable and reliable operation.

Communication Protocol: ASYNC, BIT

Supports asynchronous communication and bit-level data transfer, making it versatile for various applications.

Maximum Clock Frequency: 5.71 MHz

High clock frequency allows for fast data transfer rates, making the product suitable for high-speed applications.

Temperature Grade: COMMERCIAL

Designed for commercial use, ensuring compatibility with standard operating environments.

Technical Specifications

Serial Communication Controllers TL16C452FN attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

CENTRONIX PRINTER INTERFACE

Address Bus Width:

3

Boundary Scan:

NO

Bus Compatibility:

IBM PC-AT

Maximum Clock Frequency:

5.71 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.03125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e4

Length:

24.23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

8

No. of Serial I/Os:

2

No. of Terminals:

68

On Chip Data RAM Width:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Trade Compliance

TL16C452FN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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