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TL16C2552IFN

Texas Instruments

TL16C2552IFN by Texas Instruments

TL16C2552IFN by Texas Instruments is a Serial Communication Controller with 5.5V max supply voltage, 24MHz clock frequency, and 0.1875MBps data transfer rate. Ideal for industrial applications requiring high-speed asynchronous communication in a compact chip carrier package.

Median Price

$12.510

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 61 parts In-Stock

1+ parts

$12.510

100+ parts

$9.700

1k+ parts

$6.510

10k+ parts

-

61

$12.510

$9.700

$6.510

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 262 parts In-Stock

1+ parts

$7.780

100+ parts

-

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262

$7.780

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Chip Stock

USA . 6,244 parts In-Stock

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6,244

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Vyrian

USA . 3,325 parts In-Stock

1+ parts

-

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3,325

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QIE Inc.

USA . 111 parts In-Stock

1+ parts

-

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111

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Distributors (Availability)

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Corphita

USA . 4,050 parts In-Stock

1+ parts

$7.371

100+ parts

-

1k+ parts

-

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4,050

$7.371

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Parana Technologies

USA . 1,309 parts In-Stock

1+ parts

$58.294

100+ parts

$5,413.492

1k+ parts

$52.465

10k+ parts

-

1,309

$58.294

$5,413.492

$52.465

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DigiPath Technology Company

USA . 1,682 parts In-Stock

1+ parts

$64.189

100+ parts

-

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1,682

$64.189

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ChromeModa Solutions

Germany . 3,919 parts In-Stock

1+ parts

$65.499

100+ parts

$53.709

1k+ parts

-

10k+ parts

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3,919

$65.499

$53.709

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IDEA Electronic Components Group

UK . 1,482 parts In-Stock

1+ parts

$65.499

100+ parts

$62.224

1k+ parts

$58.949

10k+ parts

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1,482

$65.499

$62.224

$58.949

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Lixinc

USA . 19,102 parts In-Stock

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19,102

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A-Z Elektronik GmbH

Germany . 6,530 parts In-Stock

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6,530

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 228 parts In-Stock

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228

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Kepictronics

USA . 72 parts In-Stock

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72

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Overview

Enhance your communication systems with the TL16C2552IFN by Texas Instruments, a top-tier manufacturer known for quality and reliability. As a leading Serial Communication Controller, this product offers seamless data transfer at high speeds, making it perfect for industrial applications where efficiency is key. With a wide supply voltage range and temperature grade, customers can trust in the durability and performance of this chip carrier package. Upgrade your systems today with the TL16C2552IFN and experience the value, benefits, and advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to wear and tear, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Supports a wide range of power inputs, making it versatile and compatible with various systems.

Communication Protocol: ASYNC, BIT

Supports asynchronous communication and bit-based data transfer, suitable for a variety of applications.

Maximum Data Transfer Rate: 0.1875 MBps

Provides fast and efficient data transmission, enhancing the performance of the product.

Maximum Clock Frequency: 24 MHz

Enables high-speed processing and data transfer, making the product suitable for demanding tasks.

Moisture Sensitivity Level (MSL): 3

Ensures reliability in humid or damp environments, making the product suitable for a wide range of conditions.

Technical Specifications

Serial Communication Controllers TL16C2552IFN attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.8V/2.5V/3.3V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

24 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.1875 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e4

Length:

16.585 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

7.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.585 mm

Trade Compliance

TL16C2552IFN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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