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TL16C2552FNG4

Texas Instruments

TL16C2552FNG4 by Texas Instruments

TL16C2552FNG4 by Texas Instruments is a Serial Communication Controller with 5.5V max supply voltage, 24MHz clock frequency, and 0.1875MBps data transfer rate. Ideal for applications requiring high-speed asynchronous communication in commercial-grade environments.

Median Price

$12.360

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 9 parts In-Stock

1+ parts

$12.360

100+ parts

$6.010

1k+ parts

$5.670

10k+ parts

-

9

$12.360

$6.010

$5.670

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,164 parts In-Stock

1+ parts

$9.291

100+ parts

-

1k+ parts

-

10k+ parts

-

2,164

$9.291

-

-

-

Vyrian

USA . 7,058 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,058

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 104 parts In-Stock

1+ parts

$8.802

100+ parts

-

1k+ parts

-

10k+ parts

-

104

$8.802

-

-

-

Parana Technologies

USA . 2,100 parts In-Stock

1+ parts

$29.149

100+ parts

-

1k+ parts

$56.044

10k+ parts

-

2,100

$29.149

-

$56.044

-

DigiPath Technology Company

USA . 2,000 parts In-Stock

1+ parts

$32.097

100+ parts

$29.529

1k+ parts

-

10k+ parts

-

2,000

$32.097

$29.529

-

-

ChromeModa Solutions

Germany . 2,603 parts In-Stock

1+ parts

$32.752

100+ parts

$26.857

1k+ parts

-

10k+ parts

-

2,603

$32.752

$26.857

-

-

IDEA Electronic Components Group

UK . 1,239 parts In-Stock

1+ parts

$32.752

100+ parts

$31.114

1k+ parts

$29.477

10k+ parts

-

1,239

$32.752

$31.114

$29.477

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Microchip USA

USA . 2,334 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,334

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Overview

Enhance your communication systems with the TL16C2552FNG4 by Texas Instruments, a top-tier manufacturer known for its quality products. This Serial Communication Controller offers seamless data transfer at high speeds, making it ideal for a wide range of applications. From industrial automation to telecommunications, this versatile chip carrier package ensures reliable performance and optimal connectivity. Upgrade your projects with this efficient solution that guarantees value, benefits, and unparalleled advantages for all your communication needs. Trust Texas Instruments to deliver excellence in every product they create.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the controller, making it suitable for various environmental conditions.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this controller can operate effectively with a wide range of power sources, increasing its versatility.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication protocol and bit-level data transfer allows for efficient and reliable data transmission between devices.

Maximum Clock Frequency: 24 MHz

The high maximum clock frequency enables fast data processing and communication speeds, making this controller suitable for applications requiring real-time data transfer.

Temperature Grade: COMMERCIAL

Designed for commercial use, this controller can operate within standard temperature ranges typically found in office and industrial environments.

Technical Specifications

Serial Communication Controllers TL16C2552FNG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.8V/2.5V/3.3V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

24 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.1875 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e4

Length:

16.585 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

7.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.585 mm

Trade Compliance

TL16C2552FNG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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