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TISPL758LF3DR

Texas Instruments

TISPL758LF3DR by Texas Instruments

TISPL758LF3DR by Texas Instruments is a Silicon Surge Protector with 20A Non Repetitive Peak On-state Current, 130V Min Breakdown Voltage, and 180V Max DC Off-state Voltage. It is used for surge protection in various applications due to its SERIES CONNECTED configuration and GULL WING terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,500 parts In-Stock

1+ parts

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7,500

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Digiode

USA . 2,125 parts In-Stock

1+ parts

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2,125

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 327 parts In-Stock

1+ parts

$2.100

100+ parts

$2.048

1k+ parts

$2.037

10k+ parts

-

327

$2.100

$2.048

$2.037

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Ampacity Inc.

Singapore . 1,061 parts In-Stock

1+ parts

$3.100

100+ parts

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1,061

$3.100

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Parana Technologies

USA . 929 parts In-Stock

1+ parts

$3.342

100+ parts

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1k+ parts

$3.866

10k+ parts

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929

$3.342

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$3.866

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DigiPath Technology Company

USA . 1,794 parts In-Stock

1+ parts

$3.680

100+ parts

$3.386

1k+ parts

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1,794

$3.680

$3.386

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IDEA Electronic Components Group

UK . 1,971 parts In-Stock

1+ parts

$3.755

100+ parts

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1k+ parts

$3.380

10k+ parts

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1,971

$3.755

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$3.380

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ChromeModa Solutions

Germany . 725 parts In-Stock

1+ parts

$3.755

100+ parts

$3.079

1k+ parts

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725

$3.755

$3.079

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AZTECH Wire

Italy . 192 parts In-Stock

1+ parts

$6.995

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192

$6.995

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One Stop Electronics

USA . 756 parts In-Stock

1+ parts

$24.100

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756

$24.100

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Corphita

USA . 4,620 parts In-Stock

1+ parts

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4,620

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Corohmni

South Africa . 57 parts In-Stock

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57

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Overview

Protect your electronics with the reliable TISPL758LF3DR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and performance in their Silicon Surge Protectors. Ideal for a wide range of applications, this product offers peace of mind knowing your devices are safeguarded from power surges. With its high functionality and durability, the TISPL758LF3DR is a valuable investment for customers looking to protect their valuable equipment. Experience the benefits of superior surge protection with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection, making it a reliable choice for surge protection.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

The series connected configuration with center tap and 2 elements ensures effective surge protection and helps in dissipating excess voltage.

Non Repetitive Peak On-state Current: 20 A

The high on-state current rating of 20A allows the surge protector to handle sudden spikes in electrical current effectively, protecting connected devices.

Surface Mount: YES

Being surface mountable makes installation easy and convenient, especially in compact or crowded spaces.

Minimum Breakdown Voltage: 130 V

The low minimum breakdown voltage of 130V ensures that the surge protector activates quickly in response to overvoltage situations, offering enhanced protection.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient utilization of space and easy integration into different circuit designs.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, reducing the risk of disconnection during operation.

No. of Elements: 2

Having 2 elements enhances the surge protector's ability to handle high voltage transients and protect sensitive electronic components.

No. of Terminals: 8

The 8 terminals offer flexibility in circuit connectivity and allow for versatile installation options.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for efficient PCB layout, making it suitable for compact electronic devices.

Maximum DC Off-state Voltage: 180 V

The maximum off-state voltage of 180V ensures that the surge protector can handle a wide range of overvoltage conditions, providing comprehensive protection.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, the surge protector can withstand elevated temperatures and harsh environmental conditions, ensuring reliable performance.

Trigger Device Type: SILICON SURGE PROTECTOR

Being a silicon surge protector, it offers fast response times and high reliability in protecting equipment from transient voltage surges, making it a trustworthy choice for surge protection.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the surge protector to function effectively in cold environments, providing consistent protection throughout varying temperature conditions.

Terminal Position: DUAL

The dual terminal position offers versatile wiring options and allows for easy integration into different circuit configurations.

Maximum Breakdown Voltage: 220 V

The high maximum breakdown voltage of 220V ensures robust protection against overvoltage events, safeguarding connected devices from potential damage.

Technical Specifications

Silicon Surge Protectors TISPL758LF3DR attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

220 V

Minimum Breakdown Voltage:

130 V

Maximum DC Off-state Voltage:

180 V

JESD-30 Code:

R-PDSO-G8

Non Repetitive Peak On-state Current:

20 A

No. of Elements:

2

No. of Terminals:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Silicon Surge Protectors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISPL758LF3DR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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