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TISP7350F3SL

Texas Instruments

TISP7350F3SL by Texas Instruments

TISP7350F3SL by Texas Instruments is a 3-element surge protector with 7.1A peak current, 350V breakdown voltage, and thyristor trigger. Ideal for protecting electronic devices from power surges in various applications due to its UL recognized standard and delta-connected configuration.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,649 parts In-Stock

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7,649

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Digiode

USA . 4,247 parts In-Stock

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4,247

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 94 parts In-Stock

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94

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,407 parts In-Stock

1+ parts

$4.399

100+ parts

-

1k+ parts

$4.817

10k+ parts

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1,407

$4.399

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$4.817

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ChromeModa Solutions

Germany . 5,757 parts In-Stock

1+ parts

$4.943

100+ parts

$4.053

1k+ parts

-

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5,757

$4.943

$4.053

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IDEA Electronic Components Group

UK . 1,257 parts In-Stock

1+ parts

$4.943

100+ parts

-

1k+ parts

$4.449

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1,257

$4.943

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$4.449

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AZTECH Wire

Italy . 688 parts In-Stock

1+ parts

$5.290

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688

$5.290

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One Stop Electronics

USA . 1,360 parts In-Stock

1+ parts

$24.100

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1,360

$24.100

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Corphita

USA . 3,776 parts In-Stock

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3,776

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DigiPath Technology Company

USA . 779 parts In-Stock

1+ parts

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$4.457

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779

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$4.457

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Overview

Experience peace of mind with the TISP7350F3SL by Texas Instruments, a top-of-the-line Silicon Surge Protector that guarantees unmatched quality and reliability. Manufactured by industry leader Texas Instruments, this product offers superior protection for your electronic devices, ensuring they are safeguarded against power surges and voltage spikes. With its innovative design and advanced technology, the TISP7350F3SL is ideal for a wide range of applications. Trust in Texas Instruments to deliver the best-in-class surge protection solutions that provide value, benefits, and peace of mind to our customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy materials makes this surge protector lightweight and durable, making it easy to install and long-lasting.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements ensures efficient protection against surges and spikes, providing a stable and reliable performance.

Non Repetitive Peak On-state Current: 7.1 A

With a high non repetitive peak on-state current of 7.1 A, this surge protector can handle sudden surges effectively, protecting your devices from damage.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for easy and secure connections, ensuring a stable installation of the surge protector in your electrical system.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this surge protector can function effectively even in high-temperature environments, providing continuous protection.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The thyristor surge protector type is known for its high-speed response to surges, offering quick protection to your devices and preventing any damage.

Technical Specifications

Silicon Surge Protectors TISP7350F3SL attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

350 V

JESD-30 Code:

R-PSIP-T3

Non Repetitive Peak On-state Current:

7.1 A

No. of Elements:

3

No. of Terminals:

3

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Silicon Surge Protectors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP7350F3SL Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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