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TISP2082F3DR

Texas Instruments

TISP2082F3DR by Texas Instruments

TISP2082F3DR by Texas Instruments is a silicon surge protector with 4A non-repetitive peak on-state current and 82V max breakdown voltage. It features a delta connected configuration, Gull Wing terminal form, and is UL recognized. Ideal for protecting electronic devices from voltage surges in surface mount applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,606 parts In-Stock

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3,606

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Digiode

USA . 1,208 parts In-Stock

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1,208

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Distributors (Availability)

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Parana Technologies

USA . 1,988 parts In-Stock

1+ parts

$2.310

100+ parts

-

1k+ parts

$2.810

10k+ parts

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1,988

$2.310

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$2.810

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DigiPath Technology Company

USA . 83 parts In-Stock

1+ parts

$2.543

100+ parts

$2.340

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83

$2.543

$2.340

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IDEA Electronic Components Group

UK . 1,632 parts In-Stock

1+ parts

$2.595

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$2.336

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1,632

$2.595

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$2.336

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ChromeModa Solutions

Germany . 743 parts In-Stock

1+ parts

$2.595

100+ parts

$2.128

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743

$2.595

$2.128

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Semicontronic

India . 437 parts In-Stock

1+ parts

$6.100

100+ parts

$5.948

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$5.917

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437

$6.100

$5.948

$5.917

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One Stop Electronics

USA . 1,052 parts In-Stock

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$16.100

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1,052

$16.100

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AZTECH Wire

Italy . 775 parts In-Stock

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$18.720

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775

$18.720

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Ampacity Inc.

Singapore . 300 parts In-Stock

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$30.100

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300

$30.100

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Corphita

USA . 3,176 parts In-Stock

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3,176

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Corohmni

South Africa . 143 parts In-Stock

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Overview

Protect your electronic devices with the TISP2082F3DR by Texas Instruments, a high-quality Silicon Surge Protector designed to safeguard against voltage spikes. Manufactured by industry leader Texas Instruments, this product offers reliable protection for your valuable equipment, ensuring peace of mind and uninterrupted performance. Ideal for a wide range of applications, the TISP2082F3DR is a cost-effective solution that delivers superior protection and lasting value to customers. Trust Texas Instruments to keep your devices safe and secure.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring long-term reliability.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements provides efficient protection against power surges and ensures optimal performance.

Non Repetitive Peak On-state Current: 4 A

With a peak on-state current of 4 A, the surge protector can effectively handle sudden high currents without being damaged.

Surface Mount: YES

Being surface mountable, this surge protector can be easily integrated into circuit boards or other electronic devices.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and installation in electronic devices, saving space and providing convenience.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and connection, making installation hassle-free.

Maximum DC Off-state Voltage: 66 V

With a maximum off-state voltage of 66 V, this surge protector offers efficient protection against overvoltage conditions in the circuit.

Trigger Device Type: SILICON SURGE PROTECTOR

The silicon surge protector trigger device type ensures quick response and activation in the event of a surge, safeguarding connected devices.

Maximum Breakdown Voltage: 82 V

The maximum breakdown voltage of 82 V provides an additional margin of safety in case of unexpected voltage spikes or surges.

Reference Standard: UL RECOGNIZED

Being UL recognized ensures that this surge protector meets industry standards for safety and quality, giving users peace of mind.

Technical Specifications

Silicon Surge Protectors TISP2082F3DR attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

82 V

Maximum DC Off-state Voltage:

66 V

JESD-30 Code:

R-PDSO-G8

Non Repetitive Peak On-state Current:

4 A

No. of Elements:

3

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP2082F3DR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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