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TISP2260F3SL

Texas Instruments

TISP2260F3SL by Texas Instruments

TISP2260F3SL by Texas Instruments is a silicon surge protector with 3 elements in delta configuration. It has a max breakdown voltage of 260V and can handle non-repetitive peak on-state current of 6A. Ideal for protecting electronic devices from voltage surges, it is UL recognized and features through-hole terminals in a rectangular package shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,801 parts In-Stock

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R&J Components

USA . 926 parts In-Stock

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Digiode

USA . 758 parts In-Stock

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Parana Technologies

USA . 2,151 parts In-Stock

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$2.113

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$2.628

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$2.113

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DigiPath Technology Company

USA . 2,111 parts In-Stock

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$2.327

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$2.327

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ChromeModa Solutions

Germany . 3,477 parts In-Stock

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$2.374

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$1.947

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3,477

$2.374

$1.947

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IDEA Electronic Components Group

UK . 748 parts In-Stock

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$2.374

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$2.137

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748

$2.374

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$2.137

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AZTECH Wire

Italy . 542 parts In-Stock

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$14.412

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$14.412

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One Stop Electronics

USA . 582 parts In-Stock

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$23.100

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Corphita

USA . 4,902 parts In-Stock

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Overview

Protect your valuable electronic devices with the TISP2260F3SL by Texas Instruments, a top-of-the-line Silicon Surge Protector designed to safeguard against power surges and spikes. Manufactured by the trusted brand Texas Instruments, this surge protector offers reliable protection and peace of mind for your electronics. With its innovative design and high-quality construction, the TISP2260F3SL is the ideal choice for a wide range of applications where surge protection is crucial. Invest in the TISP2260F3SL today and ensure the safety and longevity of your electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the surge protector, making it a reliable choice for long-term use.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements provides efficient and effective surge protection, offering multi-level defense against voltage spikes.

Non Repetitive Peak On-state Current: 6 A

The high peak on-state current of 6A allows the surge protector to handle sudden spikes in current without getting damaged, ensuring continuous protection for connected devices.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy installation and placement of the surge protector in various settings, making it convenient for use.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure and stable connections, ensuring reliable performance of the surge protector in different applications.

Maximum DC Off-state Voltage: 200 V

With a maximum off-state voltage of 200V, this surge protector can effectively protect connected devices from high voltage spikes, safeguarding them from potential damage.

Trigger Device Type: SILICON SURGE PROTECTOR

The use of silicon surge protector as the trigger device ensures quick response to surge events, providing instant protection to connected equipment.

Maximum Breakdown Voltage: 260 V

The high breakdown voltage of 260V allows the surge protector to effectively clamp down voltage surges above this threshold, preventing damage to sensitive electronics.

Reference Standard: UL RECOGNIZED

Being UL recognized means that this surge protector meets industry safety and performance standards, giving users peace of mind about its reliability and quality.

Technical Specifications

Silicon Surge Protectors TISP2260F3SL attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

260 V

Maximum DC Off-state Voltage:

200 V

JESD-30 Code:

R-PSIP-T3

Non Repetitive Peak On-state Current:

6 A

No. of Elements:

3

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP2260F3SL Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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