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TISP5070H3BJ

Texas Instruments

TISP5070H3BJ by Texas Instruments

TISP5070H3BJ by Texas Instruments is a single silicon surge protector with 60A non-repetitive peak on-state current. It is a surface-mount device with a max breakdown voltage of 70V, suitable for protecting electronic circuits from voltage surges in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,265 parts In-Stock

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5,265

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Digiode

USA . 4,994 parts In-Stock

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4,994

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 186 parts In-Stock

1+ parts

$3.290

100+ parts

-

1k+ parts

$3.814

10k+ parts

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186

$3.290

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$3.814

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DigiPath Technology Company

USA . 528 parts In-Stock

1+ parts

$3.623

100+ parts

-

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528

$3.623

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IDEA Electronic Components Group

UK . 2,262 parts In-Stock

1+ parts

$3.697

100+ parts

-

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$3.327

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2,262

$3.697

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$3.327

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ChromeModa Solutions

Germany . 1,274 parts In-Stock

1+ parts

$3.697

100+ parts

$3.032

1k+ parts

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1,274

$3.697

$3.032

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AZTECH Wire

Italy . 337 parts In-Stock

1+ parts

$8.554

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337

$8.554

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Semicontronic

India . 1,422 parts In-Stock

1+ parts

$10.100

100+ parts

$9.848

1k+ parts

$9.797

10k+ parts

-

1,422

$10.100

$9.848

$9.797

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Ampacity Inc.

Singapore . 1,189 parts In-Stock

1+ parts

$17.100

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1,189

$17.100

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One Stop Electronics

USA . 625 parts In-Stock

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$27.100

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625

$27.100

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Kepictronics

USA . 60,000 parts In-Stock

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60,000

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Corphita

USA . 4,337 parts In-Stock

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4,337

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Corohmni

South Africa . 108 parts In-Stock

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108

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Overview

Protect your valuable electronics with the TISP5070H3BJ by Texas Instruments, a top-quality silicon surge protector that offers unparalleled protection against voltage spikes. Manufactured by industry leader Texas Instruments, this product guarantees reliability and durability. Ideal for a wide range of applications, this surge protector is a must-have for anyone looking to safeguard their devices from power surges. Invest in the TISP5070H3BJ today and enjoy peace of mind knowing your electronics are safe from potential damage.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the surge protector durable and resistant to damage.

Configuration: SINGLE

The single configuration simplifies installation and maintenance of the surge protector.

Non Repetitive Peak On-state Current: 60 A

The high peak on-state current capability ensures effective protection against power surges.

Surface Mount: YES

Being surface mountable allows for easy integration into electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to fit the surge protector in various applications.

Terminal Form: C BEND

The C bend terminal form provides a secure connection for reliable performance.

No. of Terminals: 2

Having 2 terminals simplifies the connection process and avoids confusion.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for compact designs.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, the surge protector can withstand demanding environments.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The thyristor surge protector type offers fast response times to protect connected equipment.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the surge protector can function in a wide range of conditions.

Terminal Position: DUAL

The dual terminal position allows for flexibility in installation and connection options.

Maximum Holding Current: 600 mA

The high maximum holding current ensures the surge protector can handle continuous overvoltage situations.

Maximum Breakdown Voltage: 70 V

With a maximum breakdown voltage of 70V, the surge protector provides reliable protection against voltage spikes.

Reference Standard: UL RECOGNIZED

Being UL recognized assures quality and compliance with safety standards.

Technical Specifications

Silicon Surge Protectors TISP5070H3BJ attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

70 V

Configuration:

Maximum Holding Current:

600 mA

JEDEC-95 Code:

DO-214AA

JESD-30 Code:

R-PDSO-C2

Non Repetitive Peak On-state Current:

60 A

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Breakover Diodes

Surface Mount:

YES

Terminal Form:

C BEND

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP5070H3BJ Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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