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TISP7072F3DR

Texas Instruments

TISP7072F3DR by Texas Instruments

TISP7072F3DR by Texas Instruments is a silicon surge protector with 3A peak current, 72V breakdown voltage, and UL recognition. It is a thyristor surge protector in a small outline package ideal for surface mount applications. The device features 3 elements in delta configuration for effective protection against electrical surges.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,449 parts In-Stock

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4,449

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Digiode

USA . 229 parts In-Stock

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229

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Legend Electronics Inc.

USA . 201 parts In-Stock

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201

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Distributors (Availability)

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One Stop Electronics

USA . 1,435 parts In-Stock

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$0.100

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1,435

$0.100

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Parana Technologies

USA . 2,115 parts In-Stock

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$3.610

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$4.124

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2,115

$3.610

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$4.124

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DigiPath Technology Company

USA . 1,739 parts In-Stock

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$3.975

100+ parts

$3.657

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1,739

$3.975

$3.657

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ChromeModa Solutions

Germany . 5,170 parts In-Stock

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$4.056

100+ parts

$3.326

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5,170

$4.056

$3.326

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IDEA Electronic Components Group

UK . 1,641 parts In-Stock

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$4.056

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$3.650

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1,641

$4.056

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$3.650

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AZTECH Wire

Italy . 202 parts In-Stock

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$18.673

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202

$18.673

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Component Stockers USA

USA . 718 parts In-Stock

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$99.990

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718

$99.990

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Kepictronics

USA . 36,763 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Assy Fe

Spain . 4,994 parts In-Stock

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Corphita

USA . 2,789 parts In-Stock

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2,789

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Overview

Upgrade your surge protection with the TISP7072F3DR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality silicon surge protectors that guarantee reliability and performance. This innovative device offers advanced protection against voltage spikes, ensuring the safety of your valuable electronics. With its compact design and easy installation, the TISP7072F3DR is perfect for a wide range of applications. Trust Texas Instruments to provide you with the best-in-class surge protection solutions that deliver peace of mind and unmatched quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against external elements, making it a reliable choice for surge protection.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements provides efficient surge protection by distributing the load evenly across the elements.

Non Repetitive Peak On-state Current: 3 A

With a non repetitive peak on-state current of 3 A, this surge protector can effectively handle sudden surges in current without compromising performance.

Surface Mount: YES

The surface mount capability allows for easy installation on circuit boards, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to integrate this surge protector into various electronic devices and systems.

Terminal Form: GULL WING

The gull wing terminal form provides reliable connectivity and enables secure soldering, ensuring a stable electrical connection.

Maximum DC Off-state Voltage: 58 V

With a maximum DC off-state voltage of 58 V, this surge protector can effectively handle voltage spikes and protect connected devices from damage.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The thyristor surge protector trigger device type ensures fast and efficient response to surges, providing effective protection for sensitive electronic equipment.

Technical Specifications

Silicon Surge Protectors TISP7072F3DR attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

72 V

Maximum DC Off-state Voltage:

58 V

JESD-30 Code:

R-PDSO-G8

Non Repetitive Peak On-state Current:

3 A

No. of Elements:

3

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP7072F3DR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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