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TISP4290M3LMFR

Texas Instruments

TISP4290M3LMFR by Texas Instruments

TISP4290M3LMFR by Texas Instruments is a single silicon surge protector with 32A non-repetitive peak on-state current. It has a max breakdown voltage of 290V and trigger device type as thyristor surge protector. Ideal for protecting electronic devices from power surges in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,627 parts In-Stock

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3,627

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Vyrian

USA . 2,465 parts In-Stock

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2,465

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,302 parts In-Stock

1+ parts

$3.138

100+ parts

$291.424

1k+ parts

$2.824

10k+ parts

-

1,302

$3.138

$291.424

$2.824

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DigiPath Technology Company

USA . 90 parts In-Stock

1+ parts

$3.455

100+ parts

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90

$3.455

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ChromeModa Solutions

Germany . 6,458 parts In-Stock

1+ parts

$3.526

100+ parts

$2.891

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6,458

$3.526

$2.891

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IDEA Electronic Components Group

UK . 2,136 parts In-Stock

1+ parts

$3.526

100+ parts

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1k+ parts

$3.173

10k+ parts

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2,136

$3.526

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$3.173

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Semicontronic

India . 1,042 parts In-Stock

1+ parts

$4.100

100+ parts

$3.998

1k+ parts

$3.977

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1,042

$4.100

$3.998

$3.977

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AZTECH Wire

Italy . 441 parts In-Stock

1+ parts

$9.596

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441

$9.596

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Ampacity Inc.

Singapore . 1,177 parts In-Stock

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$13.100

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1,177

$13.100

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One Stop Electronics

USA . 987 parts In-Stock

1+ parts

$28.100

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987

$28.100

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Corphita

USA . 2,792 parts In-Stock

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2,792

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Corohmni

South Africa . 244 parts In-Stock

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244

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Overview

Protect your valuable electronic devices with the TISP4290M3LMFR by Texas Instruments, a top-quality Silicon Surge Protector. With a reputation for excellence, Texas Instruments ensures that this single configuration protector offers reliable protection against voltage spikes and surges. Ideal for use in various applications, this device is designed to safeguard your equipment from damage, saving you time and money in the long run. Trust Texas Instruments for superior quality and peace of mind when it comes to protecting your electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy as the package body material provides durability and protection for the surge protector, ensuring a longer lifespan.

Configuration: SINGLE

The single configuration makes it easy to install and use, simplifying the setup process for the user.

Non Repetitive Peak On-state Current: 32 A

With a high non-repetitive peak on-state current of 32A, this surge protector can effectively handle sudden surges in electrical currents, providing reliable protection.

Package Shape: ROUND

The round package shape is compact and space-saving, making it ideal for installations where space is limited.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures a secure and stable connection during installation, reducing the risk of loose connections and potential electrical hazards.

No. of Terminals: 2

Having 2 terminals simplifies the wiring process and connection to the circuit, making it user-friendly.

Package Style (Meter): CYLINDRICAL

The cylindrical package style is aesthetically pleasing and easy to integrate into a variety of applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this surge protector can withstand high temperatures without compromising performance.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The thyristor surge protector is known for its quick response time and effectiveness in clamping high-voltage spikes, offering reliable protection against power surges.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, this surge protector remains functional even in extremely cold conditions, making it suitable for a wide range of environments.

Terminal Position: BOTTOM

Having the terminal at the bottom makes it easier to connect and install the surge protector in various configurations, ensuring a secure and stable connection.

Maximum Holding Current: 600 mA

The high maximum holding current of 600mA ensures that the surge protector can handle transient overcurrent conditions without tripping or failing, providing continuous protection.

Maximum Breakdown Voltage: 290 V

With a maximum breakdown voltage of 290V, this surge protector can effectively suppress voltage spikes and protect connected devices from damage.

Reference Standard: UL RECOGNIZED

Being UL recognized ensures that this surge protector meets safety and quality standards, giving the user peace of mind when using the product.

Technical Specifications

Silicon Surge Protectors TISP4290M3LMFR attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

290 V

Configuration:

Maximum Holding Current:

600 mA

JESD-30 Code:

O-PBCY-T2

Non Repetitive Peak On-state Current:

32 A

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Silicon Surge Protectors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP4290M3LMFR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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