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TISP2125F3DR

Texas Instruments

TISP2125F3DR by Texas Instruments

TISP2125F3DR by Texas Instruments is a silicon surge protector with 3 delta-connected elements. It has a max breakdown voltage of 125V and non-repetitive peak on-state current of 4A. Ideal for protecting electronic circuits from voltage surges, it features a small outline package shape and gull wing terminal form for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,945 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,945

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-

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Digiode

USA . 631 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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631

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,402 parts In-Stock

1+ parts

$4.445

100+ parts

-

1k+ parts

$4.873

10k+ parts

-

1,402

$4.445

-

$4.873

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DigiPath Technology Company

USA . 752 parts In-Stock

1+ parts

$4.894

100+ parts

$4.503

1k+ parts

-

10k+ parts

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752

$4.894

$4.503

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ChromeModa Solutions

Germany . 4,710 parts In-Stock

1+ parts

$4.994

100+ parts

$4.095

1k+ parts

-

10k+ parts

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4,710

$4.994

$4.095

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IDEA Electronic Components Group

UK . 5 parts In-Stock

1+ parts

$4.994

100+ parts

-

1k+ parts

$4.495

10k+ parts

-

5

$4.994

-

$4.495

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AZTECH Wire

Italy . 336 parts In-Stock

1+ parts

$10.360

100+ parts

-

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336

$10.360

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One Stop Electronics

USA . 841 parts In-Stock

1+ parts

$18.100

100+ parts

-

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841

$18.100

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Ampacity Inc.

Singapore . 1,228 parts In-Stock

1+ parts

$23.100

100+ parts

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1,228

$23.100

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Semicontronic

India . 868 parts In-Stock

1+ parts

$28.100

100+ parts

$27.398

1k+ parts

$27.257

10k+ parts

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868

$28.100

$27.398

$27.257

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Corphita

USA . 789 parts In-Stock

1+ parts

-

100+ parts

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789

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Corohmni

South Africa . 375 parts In-Stock

1+ parts

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375

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Overview

Protect your valuable electronic devices with the TISP2125F3DR by Texas Instruments, a high-quality silicon surge protector designed for maximum performance and reliability. Manufactured by industry leader Texas Instruments, this product offers superior protection against electrical surges, ensuring the safety and longevity of your equipment. Ideal for a wide range of applications, this surge protector is a cost-effective solution that provides peace of mind for customers looking to safeguard their investments. Say goodbye to unexpected damage and downtime with the TISP2125F3DR - your trusted partner in surge protection.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the surge protector, ensuring a longer lifespan.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements offers efficient protection against power surges, enhancing the overall performance of the surge protector.

Non Repetitive Peak On-state Current: 4 A

With a non repetitive peak on-state current of 4 A, this surge protector can effectively handle sudden spikes in current without compromising on safety.

Surface Mount: YES

Being surface mountable allows for easy installation of the surge protector in various applications, making it a convenient choice for users.

Maximum Breakdown Voltage: 125 V

The maximum breakdown voltage of 125 V ensures that the surge protector can handle high voltage levels, providing reliable protection for connected devices.

Technical Specifications

Silicon Surge Protectors TISP2125F3DR attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

125 V

Maximum DC Off-state Voltage:

100 V

JESD-30 Code:

R-PDSO-G8

Non Repetitive Peak On-state Current:

4 A

No. of Elements:

3

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP2125F3DR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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