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TISP7380F3D

Texas Instruments

TISP7380F3D by Texas Instruments

TISP7380F3D by Texas Instruments is a silicon surge protector with 4.3A peak current, 270V DC voltage, and 380V breakdown voltage. It is a thyristor surge protector in a small outline package suitable for surface mount applications. The device has 3 elements in delta configuration with gull wing terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,928 parts In-Stock

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4,928

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Elcom Components

USA . 558 parts In-Stock

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558

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Digiode

USA . 125 parts In-Stock

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125

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Lantek

USA . 15 parts In-Stock

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15

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Distributors (Availability)

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Parana Technologies

USA . 177 parts In-Stock

1+ parts

$2.903

100+ parts

$269.604

1k+ parts

$2.613

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177

$2.903

$269.604

$2.613

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DigiPath Technology Company

USA . 528 parts In-Stock

1+ parts

$3.197

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528

$3.197

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ChromeModa Solutions

Germany . 2,135 parts In-Stock

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$3.262

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$2.675

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2,135

$3.262

$2.675

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IDEA Electronic Components Group

UK . 1,086 parts In-Stock

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$3.262

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$2.936

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1,086

$3.262

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$2.936

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One Stop Electronics

USA . 1,363 parts In-Stock

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$6.100

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$6.100

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AZTECH Wire

Italy . 429 parts In-Stock

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$13.839

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429

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Corphita

USA . 1,501 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Protect your valuable electronic devices with the TISP7380F3D by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-quality silicon surge protectors that offer reliable protection against power surges and spikes. Ideal for various applications, this surge protector is designed with 3 elements in a delta connected configuration for maximum efficiency. With its UL recognized reference standard and high peak on-state current, the TISP7380F3D provides customers with peace of mind knowing their equipment is safeguarded. Trust Texas Instruments for superior surge protection solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and resistance to harsh environmental conditions, making this surge protector a reliable choice for long-lasting protection.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements provides efficient protection against surges by distributing the load evenly and effectively managing excess voltage.

Non Repetitive Peak On-state Current: 4.3 A

With a high non-repetitive peak on-state current of 4.3 A, this surge protector can handle sudden spikes in current without malfunctioning, ensuring reliable protection for connected devices.

Surface Mount: YES

The ability to be surface mounted makes installation easy and convenient, allowing for seamless integration into existing systems or circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and space-saving design, making it ideal for applications where space is limited.

Terminal Form: GULL WING

The gull wing terminal form ensures secure connections and easy soldering, enhancing the overall reliability and performance of the surge protector.

No. of Elements: 3

Having 3 elements increases the efficiency and effectiveness of the surge protector in dissipating excess voltage and providing protection for connected devices.

No. of Terminals: 8

With 8 terminals, this surge protector offers flexibility in installation and connectivity options, catering to a variety of wiring configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes this surge protector versatile and suitable for applications where space is at a premium, without compromising on performance.

Maximum DC Off-state Voltage: 270 V

The high maximum DC off-state voltage rating of 270 V ensures reliable protection against overvoltage events, safeguarding connected devices from potential damage.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The use of a thyristor surge protector as the trigger device provides quick response and effective protection against surges, enhancing the overall performance and reliability of this product.

Terminal Position: DUAL

The dual terminal position offers flexibility in wiring and installation options, allowing for easy integration into a wide range of circuit configurations.

Maximum Breakdown Voltage: 380 V

The high maximum breakdown voltage of 380 V ensures robust protection against voltage spikes, making this surge protector a reliable choice for safeguarding sensitive electronic equipment.

Reference Standard: UL RECOGNIZED

Being UL recognized signifies compliance with stringent safety and quality standards, providing assurance of reliability and performance for this surge protector.

Technical Specifications

Silicon Surge Protectors TISP7380F3D attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

380 V

Maximum DC Off-state Voltage:

270 V

JEDEC-95 Code:

MS-012AA

JESD-30 Code:

R-PDSO-G8

Non Repetitive Peak On-state Current:

4.3 A

No. of Elements:

3

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP7380F3D Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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