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TLP270M

STMicroelectronics

TLP270M by STMicroelectronics

TLP270M by STMicroelectronics is a Silicon Surge Protector with 3 elements in a delta configuration. It has a non-repetitive peak on-state current of 31A and max breakdown voltage of 400V. This surface-mount device in a small outline package is ideal for surge protection applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,932 parts In-Stock

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1,932

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Vyrian

USA . 1,911 parts In-Stock

1+ parts

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1,911

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Digiode

USA . 1,108 parts In-Stock

1+ parts

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1,108

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ECAB

Sweden . 668 parts In-Stock

1+ parts

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100+ parts

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668

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 647 parts In-Stock

1+ parts

$2.184

100+ parts

-

1k+ parts

$1.966

10k+ parts

-

647

$2.184

-

$1.966

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MKK Technologies

India . 1,236 parts In-Stock

1+ parts

$4.107

100+ parts

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1,236

$4.107

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DigiPath Technology Company

USA . 1,236 parts In-Stock

1+ parts

$4.107

100+ parts

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1,236

$4.107

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Parana Technologies

USA . 802 parts In-Stock

1+ parts

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100+ parts

$2.611

1k+ parts

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802

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$2.611

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Corphita

USA . 403 parts In-Stock

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403

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Overview

Upgrade your surge protection with the TLP270M by STMicroelectronics. With a reputation for excellence in manufacturing, this silicon surge protector offers unparalleled reliability and performance. Designed for a wide range of applications, this product provides superior protection against power surges, ensuring the safety of your electronic devices. Trust STMicroelectronics to deliver quality products that provide peace of mind for you and your customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the delicate internal components of the surge protector.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements ensures efficient and effective surge protection, distributing the load evenly across the elements.

Non Repetitive Peak On-state Current: 31 A

The high non-repetitive peak on-state current rating of 31 A indicates the surge protector's ability to handle sudden spikes in current without damage.

Surface Mount: YES

The surface mount capability allows for easy and secure installation of the surge protector on circuit boards or other surfaces, saving space and facilitating mass production.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and efficient design for the surge protector, fitting easily into electronic devices or circuit layouts.

Terminal Form: GULL WING

The gull wing terminal form ensures secure and reliable connections, preventing accidental disconnection or damage during installation or operation.

No. of Elements: 3

Having 3 elements increases the effectiveness of the surge protector, spreading the load evenly and enhancing the overall protection provided.

No. of Terminals: 10

The surge protector's 10 terminals allow for versatile connectivity options, accommodating various circuit configurations and enabling easy integration into electronic systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances the surge protector's compatibility with compact electronic devices and circuit designs, making it ideal for space-constrained applications.

Trigger Device Type: SILICON SURGE PROTECTOR

The use of silicon surge protector as the trigger device ensures reliable and fast response to surge events, effectively diverting excess voltage and safeguarding connected equipment.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides corrosion resistance and excellent solderability, facilitating the installation process and ensuring long-term performance of the surge protector.

Terminal Position: DUAL

The dual terminal position allows for flexible installation options and facilitates easy connection to external devices or circuits, providing versatility in application.

Maximum Breakdown Voltage: 400 V

The high maximum breakdown voltage of 400 V ensures reliable protection against high-voltage surges, safeguarding sensitive electronic components and equipment from damage.

Technical Specifications

Silicon Surge Protectors TLP270M attributes and parameters. Explore more Silicon Surge Protectors devices from STMicroelectronics

Specs

Maximum Breakdown Voltage:

400 V

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e0

Non Repetitive Peak On-state Current:

31 A

No. of Elements:

3

No. of Terminals:

10

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

TLP270M Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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