Loading...

NP2600SBMCT3G

Onsemi

NP2600SBMCT3G by Onsemi

NP2600SBMCT3G by Onsemi is a single silicon surge protector with 30A non-repetitive peak on-state current. It operates b/w -55 to 150 °C, has a max breakdown voltage of 300V, and is a surface-mount device ideal for protecting electronic circuits from voltage spikes.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,594 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,594

-

-

-

-

Digiode

USA . 1,437 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,437

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 781 parts In-Stock

1+ parts

$13.730

100+ parts

-

1k+ parts

-

10k+ parts

-

781

$13.730

-

-

-

SupplyDigital Components

Austria . 8,209 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,209

-

-

-

-

TANS Electronics

Latvia . 6,447 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,447

-

-

-

-

Kulean Microsystems

USA . 2,248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,248

-

-

-

-

Corphita

USA . 1,990 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,990

-

-

-

-

Problanco Electronics

Mexico . 1,232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,232

-

-

-

-

Corohmni

South Africa . 489 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

489

-

-

-

-

UHIMA Technologies

Türkiye . 397 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

397

-

-

-

-

Overview

Protect your valuable electronic devices with the NP2600SBMCT3G by Onsemi, a top-tier manufacturer of silicon surge protectors. This single configuration device offers superior protection against power surges, ensuring the longevity and reliability of your equipment. Ideal for a variety of applications, this product guarantees peace of mind and security for your technology investments. Trust Onsemi's expertise in semiconductor manufacturing to deliver a high-quality product that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection of the internal components.

Configuration: SINGLE

The single configuration simplifies installation and maintenance, making it easy to use.

Non Repetitive Peak On-state Current: 30 A

With a high non-repetitive peak on-state current of 30A, this surge protector can handle sudden power surges effectively.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape enables space-saving installation in various electronic devices.

Terminal Form: C BEND

The C bend terminal form ensures secure connections and efficient power transmission.

No. of Terminals: 2

Having 2 terminals simplifies the connection process and enhances the overall reliability of the surge protector.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes this surge protector suitable for compact electronic devices.

Maximum DC Off-state Voltage: 220 V

With a maximum DC off-state voltage of 220V, this surge protector effectively protects devices from overvoltage situations.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C ensures the surge protector can withstand harsh environmental conditions.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The use of a thyristor surge protector as the trigger device ensures reliable and fast response to surge events.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C ensures that the surge protector can function effectively in extreme cold conditions.

Terminal Finish: TIN

The tin terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term performance.

Terminal Position: DUAL

The dual terminal position allows for versatile installation options and improved electrical connection stability.

Maximum Breakdown Voltage: 300 V

The high maximum breakdown voltage of 300V provides superior protection against voltage spikes and surges.

Maximum Time At Peak Reflow Temperature (s): 30

The surge protector can withstand the peak reflow temperature for up to 30 seconds, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures proper soldering of the surge protector on circuit boards.

Reference Standard: UL RECOGNIZED

Being UL recognized indicates that this surge protector meets high safety and performance standards, making it a reliable choice for electronic applications.

Technical Specifications

Silicon Surge Protectors NP2600SBMCT3G attributes and parameters. Explore more Silicon Surge Protectors devices from Onsemi

Specs

Maximum Breakdown Voltage:

300 V

Configuration:

Maximum DC Off-state Voltage:

220 V

JEDEC-95 Code:

DO-214AA

JESD-30 Code:

R-PDSO-C2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Non Repetitive Peak On-state Current:

30 A

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

C BEND

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Device Type:

Trade Compliance

NP2600SBMCT3G Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 11