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TLP200MTR

STMicroelectronics

TLP200MTR by STMicroelectronics

TLP200MTR by STMicroelectronics is a silicon surge protector with 3 delta-connected elements. It features a non-repetitive peak on-state current of 31A and a max breakdown voltage of 290V. This surface-mount device in a small outline package is ideal for protecting electronic circuits from voltage surges.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ECAB

Sweden . 6,580 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,580

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-

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Anansix

USA . 1,952 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,952

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Vyrian

USA . 1,197 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,197

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-

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Digiode

USA . 793 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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793

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 850 parts In-Stock

1+ parts

$3.116

100+ parts

-

1k+ parts

$2.804

10k+ parts

-

850

$3.116

-

$2.804

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MKK Technologies

India . 1,715 parts In-Stock

1+ parts

$5.860

100+ parts

-

1k+ parts

-

10k+ parts

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1,715

$5.860

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-

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DigiPath Technology Company

USA . 1,715 parts In-Stock

1+ parts

$5.860

100+ parts

-

1k+ parts

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10k+ parts

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1,715

$5.860

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-

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Corphita

USA . 4,977 parts In-Stock

1+ parts

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100+ parts

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4,977

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-

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Parana Technologies

USA . 1,715 parts In-Stock

1+ parts

-

100+ parts

$3.726

1k+ parts

-

10k+ parts

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1,715

-

$3.726

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Overview

Protect your valuable electronic devices with the TLP200MTR by STMicroelectronics. This high-quality silicon surge protector offers superior protection against power surges, ensuring the safety and longevity of your equipment. With a compact design and easy surface mount installation, this product is perfect for a wide range of applications. Trust in STMicroelectronics' reputation for excellence and choose the TLP200MTR for reliable surge protection that provides peace of mind to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the surge protector.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements allows for efficient distribution of current and enhances the overall performance of the surge protector.

Non Repetitive Peak On-state Current: 31 A

With a peak on-state current of 31 A, this surge protector can effectively handle high levels of current during surge events, offering reliable protection for connected devices.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, especially in compact spaces where traditional mounting methods may not be suitable.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various electronic systems and devices, accommodating different design requirements.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and simplifies the soldering process, ensuring stable and reliable electrical connections.

No. of Elements: 3

Having 3 elements increases the efficiency and effectiveness of the surge protector in suppressing power surges and protecting connected equipment from damage.

No. of Terminals: 10

With 10 terminals, this surge protector offers flexibility in installation and enables secure connections to external circuits or devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes the surge protector compact and space-saving, ideal for applications where size constraints are a consideration.

Trigger Device Type: SILICON SURGE PROTECTOR

The use of silicon as the trigger device type enhances the responsiveness and efficiency of the surge protector in quickly diverting excess voltage away from sensitive equipment.

Terminal Finish: TIN LEAD

The tin lead terminal finish ensures good electrical conductivity and corrosion resistance, contributing to the overall reliability and longevity of the surge protector.

Terminal Position: DUAL

The dual terminal position offers flexibility in installation and allows for versatile connection options in various circuit configurations.

Maximum Breakdown Voltage: 290 V

With a maximum breakdown voltage of 290 V, this surge protector can effectively suppress transient overvoltages and protect connected devices within a safe operating range.

Technical Specifications

Silicon Surge Protectors TLP200MTR attributes and parameters. Explore more Silicon Surge Protectors devices from STMicroelectronics

Specs

Maximum Breakdown Voltage:

290 V

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e0

Non Repetitive Peak On-state Current:

31 A

No. of Elements:

3

No. of Terminals:

10

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

TLP200MTR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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