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SMTPB180

STMicroelectronics

SMTPB180 by STMicroelectronics

SMTPB180 by STMicroelectronics is a silicon surge protector designed for surface mount applications. It features a rectangular plastic/epoxy package, dual C bend terminals, and is ideal for protecting sensitive electronics from voltage spikes. Its compact size ensures efficient integration in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,983 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,983

-

-

-

-

Anansix

USA . 2,830 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,830

-

-

-

-

Digiode

USA . 698 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

698

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 121 parts In-Stock

1+ parts

$3.034

100+ parts

-

1k+ parts

$2.731

10k+ parts

-

121

$3.034

-

$2.731

-

MKK Technologies

India . 49 parts In-Stock

1+ parts

$5.706

100+ parts

-

1k+ parts

-

10k+ parts

-

49

$5.706

-

-

-

DigiPath Technology Company

USA . 49 parts In-Stock

1+ parts

$5.706

100+ parts

-

1k+ parts

-

10k+ parts

-

49

$5.706

-

-

-

Metaverse IC Inc.

Canada . 50,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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50,000

-

-

-

-

Corphita

USA . 4,545 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,545

-

-

-

-

Parana Technologies

USA . 1,804 parts In-Stock

1+ parts

-

100+ parts

$3.628

1k+ parts

-

10k+ parts

-

1,804

-

$3.628

-

-

Overview

Elevate your designs with the SMTPB180 from STMicroelectronics, a trusted leader in innovative semiconductor solutions. Engineered for excellence, this silicon surge protector ensures robust protection against voltage spikes, enhancing the reliability of your applications. With its compact surface mount design and dual terminal configuration, it's perfect for a range of devices—from consumer electronics to industrial equipment. Choose SMTPB180 for unparalleled quality and peace of mind!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of Plastic/Epoxy for the package body provides excellent insulation properties, enhancing durability and ensuring long-term reliability in protecting electronic devices from surges.

Surface Mount: YES

Being a surface mount device allows for compact designs and easy integration into various electronic assemblies, which is crucial for modern, space-constrained applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient use of space on circuit boards, enabling better layout configurations and potentially reducing manufacturing costs.

Terminal Form: C BEND

The C bend terminal form ensures secure and stable connections during soldering, which increases reliability in electrical performance and longevity of the product in operation.

No. of Terminals: 2

Having 2 terminals simplifies the connectivity and integration process, making it easier to implement in a variety of applications while still maintaining effective surge protection.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes the footprint on PCBs while providing robust surge protection, making it ideal for portable and compact electronic devices.

Trigger Device Type: SILICON SURGE PROTECTOR

As a silicon surge protector, this product efficiently absorbs voltage spikes, offering superior performance and protection compared to traditional surge protection solutions.

Terminal Position: DUAL

Dual terminal positioning allows for versatile mounting options, which can facilitate easier routing of board traces and contribute to better overall system performance.

Technical Specifications

Silicon Surge Protectors SMTPB180 attributes and parameters. Explore more Silicon Surge Protectors devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-C2

No. of Terminals:

2

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

C BEND

Terminal Position:

Trigger Device Type:

Trade Compliance

SMTPB180 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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