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TISP4300M3BJR

Texas Instruments

TISP4300M3BJR by Texas Instruments

TISP4300M3BJR by Texas Instruments is a single silicon surge protector with 32A peak current, 230V voltage, and 150°C max temp. Ideal for protecting circuits from surges in applications like power supplies and telecommunications due to its thyristor surge protection design.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Prism Electronics

USA . 68,445 parts In-Stock

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68,445

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 26,668 parts In-Stock

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R&J Components

USA . 11,861 parts In-Stock

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11,861

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Vyrian

USA . 5,232 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 151 parts In-Stock

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151

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Digiode

USA . 150 parts In-Stock

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150

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ABC Electronics Ltd.

UK . 50 parts In-Stock

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Parana Technologies

USA . 1,438 parts In-Stock

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$2.111

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$2.627

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1,438

$2.111

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$2.627

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IDEA Electronic Components Group

UK . 2,122 parts In-Stock

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$2.372

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$2.135

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ChromeModa Solutions

Germany . 259 parts In-Stock

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$2.372

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$1.945

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259

$2.372

$1.945

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AZTECH Wire

Italy . 610 parts In-Stock

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$7.330

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610

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One Stop Electronics

USA . 356 parts In-Stock

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$12.100

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Perfect Parts

USA . 529,104 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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DigiPath Technology Company

USA . 1,580 parts In-Stock

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$2.139

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Corphita

USA . 1,199 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 151 parts In-Stock

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Glotronic Ltd.

UK . 121 parts In-Stock

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Assy Fe

Spain . 50 parts In-Stock

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Overview

Shield your electronic devices from power surges with the TISP4300M3BJR by Texas Instruments, a top-quality silicon surge protector that offers unparalleled protection and reliability. Manufactured by industry leader Texas Instruments, this single configuration device is designed for a wide range of applications where surge protection is essential. With a maximum breakdown voltage of 300V and non-repetitive peak on-state current of 32A, this compact and durable protector provides peace of mind against unexpected electrical spikes, ensuring the longevity and performance of your valuable equipment. Trust Texas Instruments for superior quality and safeguard your electronics with the TISP4300M3BJR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and reliability for long-lasting protection against surges.

Configuration: SINGLE

The single configuration makes it easy to install and use, simplifying the surge protection process.

Non Repetitive Peak On-state Current: 32 A

The high peak on-state current capacity ensures that the surge protector can handle sudden spikes in power effectively.

Surface Mount: YES

The surface mount capability enables easy and convenient installation on various electronic devices or systems.

Package Shape: RECTANGULAR

The rectangular package shape allows for compact and efficient placement, saving space in electronic circuits.

Terminal Form: C BEND

The C bend terminal form provides a secure connection for stable performance and reliability in surge protection.

No. of Terminals: 2

With 2 terminals, this surge protector can effectively divert excess voltage to prevent damage to connected devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures compatibility with various electronic devices and systems for versatile surge protection.

Maximum DC Off-state Voltage: 230 V

The high maximum DC off-state voltage rating ensures protection against voltage surges within the specified range.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows for reliable performance even in potentially extreme conditions.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The thyristor surge protector design offers efficient and effective protection against power surges, safeguarding connected equipment.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the surge protector can function reliably in cold environments as well.

Terminal Position: DUAL

The dual terminal position provides flexibility in installation and connection, enhancing the versatility of this surge protector.

Maximum Holding Current: 600 mA

The high maximum holding current capacity ensures sustained protection against excessive current flow during surges.

Maximum Breakdown Voltage: 300 V

The high maximum breakdown voltage rating indicates the level at which the surge protector can divert excess voltage to protect connected devices.

Reference Standard: UL RECOGNIZED

Being UL recognized signifies that this surge protector meets high safety and performance standards, ensuring reliability and peace of mind.

Technical Specifications

Silicon Surge Protectors TISP4300M3BJR attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

300 V

Configuration:

Maximum DC Off-state Voltage:

230 V

Maximum Holding Current:

600 mA

JEDEC-95 Code:

DO-214AA

JESD-30 Code:

R-PDSO-C2

Non Repetitive Peak On-state Current:

32 A

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Silicon Surge Protectors

Surface Mount:

YES

Terminal Form:

C BEND

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP4300M3BJR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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