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TISP3240F3DR

Texas Instruments

TISP3240F3DR by Texas Instruments

TISP3240F3DR by Texas Instruments is a Silicon Surge Protector with 4A Non Repetitive Peak On-state Current, 180V Max DC Off-state Voltage, and 240V Max Breakdown Voltage. It is used for surge protection in various electronic applications due to its THYRISTOR technology and UL recognition.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,218 parts In-Stock

1+ parts

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7,218

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Digiode

USA . 434 parts In-Stock

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434

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,913 parts In-Stock

1+ parts

$2.503

100+ parts

-

1k+ parts

$2.993

10k+ parts

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1,913

$2.503

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$2.993

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IDEA Electronic Components Group

UK . 316 parts In-Stock

1+ parts

$2.812

100+ parts

-

1k+ parts

$2.531

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316

$2.812

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$2.531

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ChromeModa Solutions

Germany . 135 parts In-Stock

1+ parts

$2.812

100+ parts

$2.306

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-

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135

$2.812

$2.306

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AZTECH Wire

Italy . 438 parts In-Stock

1+ parts

$16.965

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438

$16.965

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Semicontronic

India . 1,476 parts In-Stock

1+ parts

$17.100

100+ parts

$16.672

1k+ parts

$16.587

10k+ parts

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1,476

$17.100

$16.672

$16.587

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Ampacity Inc.

Singapore . 1,160 parts In-Stock

1+ parts

$18.100

100+ parts

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1,160

$18.100

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One Stop Electronics

USA . 922 parts In-Stock

1+ parts

$30.100

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922

$30.100

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Corphita

USA . 2,595 parts In-Stock

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2,595

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DigiPath Technology Company

USA . 833 parts In-Stock

1+ parts

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100+ parts

$2.535

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833

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$2.535

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Corohmni

South Africa . 64 parts In-Stock

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64

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Overview

Safeguard your electronics with the TISP3240F3DR by Texas Instruments, a top-tier manufacturer known for reliability and innovation. As a leader in Silicon Surge Protectors, this product offers superior protection against power surges and voltage spikes, ensuring the longevity of your valuable equipment. With its compact design and advanced technology, the TISP3240F3DR is ideal for a wide range of applications, from industrial machinery to consumer electronics. Trust Texas Instruments to deliver quality products that provide peace of mind and unmatched performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the surge protector, ensuring a longer lifespan.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

Series connected configuration with center tap and 2 elements offers better protection and higher surge handling capacity.

Non Repetitive Peak On-state Current: 4 A

With a non repetitive peak on-state current of 4 A, this surge protector can effectively handle surges and protect connected devices.

Surface Mount: YES

Surface mount capability makes installation easier and more convenient in various applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy placement and mounting of the surge protector in different devices.

Terminal Form: GULL WING

Gull wing terminal form provides a secure connection and reliable performance in different operating conditions.

Maximum Breakdown Voltage: 240 V

High maximum breakdown voltage of 240 V ensures robust protection against surges and voltage spikes.

Reference Standard: UL RECOGNIZED

UL recognized standard compliance ensures that the surge protector meets safety and quality standards for reliable performance.

Technical Specifications

Silicon Surge Protectors TISP3240F3DR attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

240 V

Maximum DC Off-state Voltage:

180 V

JESD-30 Code:

R-PDSO-G8

Non Repetitive Peak On-state Current:

4 A

No. of Elements:

2

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Silicon Surge Protectors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP3240F3DR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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