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TISP4400M3LMFR

Texas Instruments

TISP4400M3LMFR by Texas Instruments

TISP4400M3LMFR by Texas Instruments is a single silicon surge protector with 32A peak current. It operates b/w -40°C to 150°C, has 400V breakdown voltage, and UL recognized. Ideal for protecting electronic devices from power surges in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,658 parts In-Stock

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8,658

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Digiode

USA . 63 parts In-Stock

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63

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Distributors (Availability)

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Parana Technologies

USA . 562 parts In-Stock

1+ parts

$4.020

100+ parts

-

1k+ parts

$4.484

10k+ parts

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562

$4.020

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$4.484

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ChromeModa Solutions

Germany . 6,473 parts In-Stock

1+ parts

$4.517

100+ parts

$3.704

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6,473

$4.517

$3.704

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IDEA Electronic Components Group

UK . 254 parts In-Stock

1+ parts

$4.517

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-

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$4.065

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254

$4.517

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$4.065

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AZTECH Wire

Italy . 561 parts In-Stock

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$11.449

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561

$11.449

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Semicontronic

India . 1,489 parts In-Stock

1+ parts

$16.100

100+ parts

$15.698

1k+ parts

$15.617

10k+ parts

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1,489

$16.100

$15.698

$15.617

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One Stop Electronics

USA . 685 parts In-Stock

1+ parts

$23.100

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685

$23.100

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Ampacity Inc.

Singapore . 1,634 parts In-Stock

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$25.100

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1,634

$25.100

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Corphita

USA . 923 parts In-Stock

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923

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DigiPath Technology Company

USA . 450 parts In-Stock

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$4.073

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450

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$4.073

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Corohmni

South Africa . 391 parts In-Stock

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Overview

Protect your valuable electronics with the TISP4400M3LMFR from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality silicon surge protectors that ensure your devices are shielded from power surges and spikes. Whether you're looking to safeguard your home appliances, industrial equipment, or telecommunications systems, this single configuration surge protector offers reliable protection with its 32A non-repetitive peak on-state current and 400V maximum breakdown voltage. Trust Texas Instruments to provide superior surge protection for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection against environmental factors, making the surge protector long-lasting and reliable.

Configuration: SINGLE

Simplified setup and operation with a single configuration.

Non Repetitive Peak On-state Current: 32 A

Capable of handling high surge currents, ensuring protection for connected devices.

Package Shape: ROUND

Compact and space-saving design, suitable for various installations.

Terminal Form: THROUGH-HOLE

Secure installation with through-hole terminals for stability and reliability.

No. of Terminals: 2

Simple connection setup with only two terminals.

Package Style (Meter): CYLINDRICAL

Sleek and versatile design for easy integration into different systems.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, suitable for various environments and applications.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

Effective surge protection with a thyristor device type for reliable performance.

Minimum Operating Temperature: -40 °C

Operates even in low temperatures, ensuring functionality in extreme conditions.

Terminal Position: BOTTOM

Convenient terminal position for easy connections and maintenance.

Maximum Holding Current: 600 mA

Capable of handling sustained current flow, providing continuous protection.

Maximum Breakdown Voltage: 400 V

High breakdown voltage rating for effective surge protection of connected devices.

Reference Standard: UL RECOGNIZED

Compliance with industry standards for safety and performance assurance.

Technical Specifications

Silicon Surge Protectors TISP4400M3LMFR attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

400 V

Configuration:

Maximum Holding Current:

600 mA

JESD-30 Code:

O-PBCY-T2

Non Repetitive Peak On-state Current:

32 A

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Silicon Surge Protectors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP4400M3LMFR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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