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TISP7250H3SL

Texas Instruments

TISP7250H3SL by Texas Instruments

TISP7250H3SL by Texas Instruments is a silicon surge protector with 60A non-repetitive peak on-state current. It features a delta connected configuration, 3 elements, and 250V max breakdown voltage. Ideal for protecting electronic devices from power surges in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Legend Electronics Inc.

USA . 23,376 parts In-Stock

1+ parts

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23,376

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Vyrian

USA . 5,409 parts In-Stock

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5,409

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Digiode

USA . 4,154 parts In-Stock

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4,154

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Zilex Electronics Inc.

Canada . 3,150 parts In-Stock

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3,150

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Cyclops Electronics Ltd

UK . 150 parts In-Stock

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150

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,749 parts In-Stock

1+ parts

$4.364

100+ parts

-

1k+ parts

$4.781

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1,749

$4.364

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$4.781

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DigiPath Technology Company

USA . 2,171 parts In-Stock

1+ parts

$4.805

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2,171

$4.805

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ChromeModa Solutions

Germany . 6,529 parts In-Stock

1+ parts

$4.903

100+ parts

$4.020

1k+ parts

-

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6,529

$4.903

$4.020

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IDEA Electronic Components Group

UK . 2,006 parts In-Stock

1+ parts

$4.903

100+ parts

-

1k+ parts

$4.413

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2,006

$4.903

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$4.413

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AZTECH Wire

Italy . 885 parts In-Stock

1+ parts

$8.960

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885

$8.960

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One Stop Electronics

USA . 621 parts In-Stock

1+ parts

$10.100

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621

$10.100

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Component Stockers USA

USA . 606 parts In-Stock

1+ parts

$99.990

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606

$99.990

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Corphita

USA . 758 parts In-Stock

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758

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Kepictronics

USA . 150 parts In-Stock

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150

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Overview

Protect your valuable electronic devices with the TISP7250H3SL by Texas Instruments, the leading manufacturer in silicon surge protectors. Designed with high-quality materials and advanced technology, this surge protector offers reliable protection against voltage spikes and surges. Ideal for a wide range of applications, this product provides peace of mind knowing your devices are safe from electrical damage. Trust in Texas Instruments for superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the surge protector lightweight and durable for easy installation and long-lasting protection.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements ensures efficient surge protection and distribution of electrical load.

Non Repetitive Peak On-state Current: 60 A

The high peak on-state current rating of 60A enables the surge protector to handle temporary surges and spikes effectively.

Package Shape: RECTANGULAR

The rectangular shape of the package provides ease of installation and space-saving design for versatile application options.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures secure and reliable connections for stable performance during surge events.

Maximum Holding Current: 600 mA

The high maximum holding current rating of 600mA allows the surge protector to continue protecting against multiple surge events without compromising its functionality.

Technical Specifications

Silicon Surge Protectors TISP7250H3SL attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

250 V

Maximum Holding Current:

600 mA

JESD-30 Code:

R-PSIP-T3

Non Repetitive Peak On-state Current:

60 A

No. of Elements:

3

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Silicon Surge Protectors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP7250H3SL Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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