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THDT5111

STMicroelectronics

THDT5111 by STMicroelectronics

THDT5111 by STMicroelectronics is a silicon surge protector designed for robust applications. It features a non-repetitive peak on-state current of 10 A, operates b/w -55 °C to 150°C, and supports surface mount configurations. Ideal for protecting sensitive electronics from voltage spikes.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,956 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,956

-

-

-

-

Digiode

USA . 3,251 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,251

-

-

-

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Anansix

USA . 539 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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539

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,592 parts In-Stock

1+ parts

$3.946

100+ parts

-

1k+ parts

$3.551

10k+ parts

-

1,592

$3.946

-

$3.551

-

MKK Technologies

India . 1,269 parts In-Stock

1+ parts

$7.420

100+ parts

-

1k+ parts

-

10k+ parts

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1,269

$7.420

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-

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DigiPath Technology Company

USA . 1,269 parts In-Stock

1+ parts

$7.420

100+ parts

-

1k+ parts

-

10k+ parts

-

1,269

$7.420

-

-

-

Parana Technologies

USA . 2,208 parts In-Stock

1+ parts

-

100+ parts

$4.718

1k+ parts

-

10k+ parts

-

2,208

-

$4.718

-

-

Corphita

USA . 1,554 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,554

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Overview

Protect your electronic devices with the THDT5111 from STMicroelectronics, a trusted leader in innovative technology. This robust silicon surge protector combines exceptional reliability and superior performance, ensuring your circuits remain safe even in challenging environments. With its compact design and efficient heat management, it’s ideal for diverse applications, from consumer electronics to industrial equipment. Choose the THDT5111 for peace of mind and enhanced durability in your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robust protection and longevity of the device, making it suitable for various challenging environments.

Configuration: COMPLEX

A complex configuration allows for advanced functionalities, enabling efficient surge protection and optimized performance in circuit designs.

Non Repetitive Peak On-state Current: 10 A

With a peak on-state current rating of 10 A, this device can handle substantial surge events, ensuring the safety and reliability of your electronic equipment.

Surface Mount: YES

Being surface mountable allows for easy integration into modern circuit board designs, saving space and improving manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact footprint, enabling high-density installation in electronic devices.

Terminal Form: GULL WING

Gull wing terminals facilitate excellent solderability and mechanical stability, ensuring secure and reliable connections.

No. of Elements: 2

The dual-element design can effectively manage surge currents in more complex applications, providing enhanced protection capabilities.

Repetitive Peak Reverse Voltage: 51 V

A reverse voltage rating of 51 V ensures that the device can withstand significant voltage spikes without failure, protecting sensitive components.

No. of Terminals: 8

With 8 terminals, this component allows for versatile connection options in circuit designs, making it adaptable for various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style optimizes board space utilization, making it suitable for compact electronic designs.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature rating of 150 °C allows the device to function reliably in hot environments, ensuring long-term performance.

Trigger Device Type: SILICON SURGE PROTECTOR

As a silicon surge protector, this device offers fast response times and effective suppression of voltage spikes, ensuring the safety of connected circuitry.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this product can be used in extremely cold environments, making it ideal for aerospace and outdoor applications.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in layout design, providing options for various circuit configurations.

Maximum Holding Current: 150 mA

A holding current of 150 mA allows the device to maintain operation under specific conditions, providing additional protection without frequent interruptions.

Maximum Clamping Voltage: 7 V

A low maximum clamping voltage ensures minimal stress on connected components during surge events, enhancing overall device longevity.

Maximum Breakdown Voltage: 70 V

The maximum breakdown voltage of 70 V allows this product to safeguard sensitive electronic circuits from excessive voltage levels efficiently.

Technical Specifications

Silicon Surge Protectors THDT5111 attributes and parameters. Explore more Silicon Surge Protectors devices from STMicroelectronics

Specs

Maximum Breakdown Voltage:

70 V

Maximum Clamping Voltage:

7 V

Configuration:

Maximum Holding Current:

150 mA

JESD-30 Code:

R-PDSO-G8

Non Repetitive Peak On-state Current:

10 A

No. of Elements:

2

No. of Terminals:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Repetitive Peak Reverse Voltage:

51 V

Sub-Category:

Silicon Surge Protectors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

THDT5111 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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