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THDT6512

STMicroelectronics

THDT6512 by STMicroelectronics

THDT6512 by STMicroelectronics is a silicon surge protector designed for robust applications. It features a non-repetitive peak on-state current of 10 A, a repetitive peak reverse voltage of 65 V, and operates b/w -55 °C to 150°C. Ideal for protecting sensitive electronics from voltage spikes.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,933 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,933

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-

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Anansix

USA . 2,201 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,201

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-

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Vyrian

USA . 1,991 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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1,991

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 701 parts In-Stock

1+ parts

$4.181

100+ parts

-

1k+ parts

$3.763

10k+ parts

-

701

$4.181

-

$3.763

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MKK Technologies

India . 1,585 parts In-Stock

1+ parts

$7.863

100+ parts

-

1k+ parts

-

10k+ parts

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1,585

$7.863

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DigiPath Technology Company

USA . 1,585 parts In-Stock

1+ parts

$7.863

100+ parts

-

1k+ parts

-

10k+ parts

-

1,585

$7.863

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-

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Corphita

USA . 4,597 parts In-Stock

1+ parts

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4,597

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Parana Technologies

USA . 1,383 parts In-Stock

1+ parts

-

100+ parts

$5.000

1k+ parts

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10k+ parts

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1,383

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$5.000

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Overview

Elevate your circuit protection with the THDT6512 from STMicroelectronics, a trusted leader in innovation and quality. Designed for reliability, this advanced silicon surge protector ensures optimal safety in various applications, from consumer electronics to industrial equipment. With its robust construction and impressive temperature resilience, the THDT6512 guarantees superior performance, providing peace of mind and longevity for your devices. Choose excellence; choose STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides excellent durability and resistance to environmental factors, ensuring long-term performance and reliability.

Configuration: COMPLEX

The complex configuration can support a variety of applications, making this product versatile for different circuit designs.

Non Repetitive Peak On-state Current: 10 A

A high on-state current capability allows the device to handle transient surges efficiently, which is crucial for protecting sensitive electronics.

Package Shape: RECTANGULAR

The rectangular shape provides a compact footprint, facilitating easier integration into various designs while maximizing space efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminals enable robust mechanical support and are ideal for high-power applications requiring stable connections.

No. of Elements: 2

Having multiple elements enhances the device's ability to manage surge events, contributing to improved overall protection.

Repetitive Peak Reverse Voltage: 65 V

This specification ensures compatibility with a range of voltage levels in various applications, making it suitable for multiple circuits.

No. of Terminals: 8

With eight terminals, this device provides flexible connection options, which facilitates easy integration into existing designs.

Package Style (Meter): IN-LINE

The in-line package style allows for straightforward schematics and easier installation in circuit layouts.

Maximum Operating Temperature: 150 °C

This high operating temperature threshold ensures reliable performance even in demanding environments, reducing the risk of failure.

Trigger Device Type: SILICON SURGE PROTECTOR

As a silicon surge protector, this device is specifically designed to absorb and redirect surge currents, enhancing the safety of connected devices.

Minimum Operating Temperature: -55 °C

The low operating temperature allows the product to function effectively in extreme conditions, broadening its range of applicable environments.

Terminal Position: DUAL

Dual terminal positioning allows for more flexible connection configurations, accommodating different layout requirements.

Maximum Holding Current: 150 mA

This specification ensures that the protector can effectively limit current during surges, safeguarding sensitive components in the circuit.

Maximum Clamping Voltage: 7 V

A low clamping voltage provides enhanced protection for downstream components, minimizing the risk of damage from transient overvoltages.

Maximum Breakdown Voltage: 85 V

This high breakdown voltage ensures that the device can operate safely under typical conditions, preventing unnecessary interruptions in performance.

Technical Specifications

Silicon Surge Protectors THDT6512 attributes and parameters. Explore more Silicon Surge Protectors devices from STMicroelectronics

Specs

Maximum Breakdown Voltage:

85 V

Maximum Clamping Voltage:

7 V

Configuration:

Maximum Holding Current:

150 mA

JESD-30 Code:

R-PDIP-T8

Non Repetitive Peak On-state Current:

10 A

No. of Elements:

2

No. of Terminals:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Repetitive Peak Reverse Voltage:

65 V

Sub-Category:

Silicon Surge Protectors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

THDT6512 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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