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TISP7240F3D

Texas Instruments

TISP7240F3D by Texas Instruments

TISP7240F3D by Texas Instruments is a silicon surge protector with 3 delta-connected elements. It has a non-repetitive peak on-state current of 4.3A and max breakdown voltage of 240V. Ideal for protecting electronic devices from voltage surges in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,020 parts In-Stock

1+ parts

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2,020

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Digiode

USA . 1,886 parts In-Stock

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1,886

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 320 parts In-Stock

1+ parts

$2.944

100+ parts

-

1k+ parts

$3.443

10k+ parts

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320

$2.944

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$3.443

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Ampacity Inc.

Singapore . 573 parts In-Stock

1+ parts

$3.100

100+ parts

-

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573

$3.100

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DigiPath Technology Company

USA . 611 parts In-Stock

1+ parts

$3.242

100+ parts

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611

$3.242

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ChromeModa Solutions

Germany . 6,924 parts In-Stock

1+ parts

$3.308

100+ parts

$2.713

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6,924

$3.308

$2.713

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IDEA Electronic Components Group

UK . 2,336 parts In-Stock

1+ parts

$3.308

100+ parts

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$2.977

10k+ parts

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2,336

$3.308

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$2.977

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AZTECH Wire

Italy . 706 parts In-Stock

1+ parts

$11.701

100+ parts

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706

$11.701

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One Stop Electronics

USA . 1,596 parts In-Stock

1+ parts

$14.100

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1,596

$14.100

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Semicontronic

India . 1,289 parts In-Stock

1+ parts

$25.100

100+ parts

$24.472

1k+ parts

$24.347

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1,289

$25.100

$24.472

$24.347

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Assy Fe

Spain . 1,392 parts In-Stock

1+ parts

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1,392

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Kepictronics

USA . 997 parts In-Stock

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997

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Corphita

USA . 685 parts In-Stock

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685

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Corohmni

South Africa . 116 parts In-Stock

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116

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Overview

Upgrade your surge protection with the TISP7240F3D by Texas Instruments. With a reputation for quality and innovation, Texas Instruments delivers reliable silicon surge protectors that are perfect for a variety of applications. Protect your electronics from voltage spikes and ensure peace of mind with this high-performing product. Trust in Texas Instruments to provide superior protection for your devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the surge protector.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements ensures efficient and effective surge protection.

Non Repetitive Peak On-state Current: 4.3 A

Can handle high peak currents during surge events, offering reliable protection for connected devices.

Surface Mount: YES

Easy to install and suitable for compact spaces.

Package Shape: RECTANGULAR

Allows for easy integration into existing setups or circuit layouts.

Terminal Form: GULL WING

Provides secure and stable connections for enhanced performance.

No. of Elements: 3

Multiple elements enhance the overall surge protection capabilities of the device.

No. of Terminals: 8

Sufficient terminals for versatile connection options.

Package Style (Meter): SMALL OUTLINE

Compact design for space-saving installations.

Maximum DC Off-state Voltage: 180 V

Able to handle high DC voltages, offering comprehensive protection for connected equipment.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

Utilizes reliable thyristor technology for effective surge protection.

Terminal Position: DUAL

Dual terminal position for added flexibility in installation.

Maximum Breakdown Voltage: 240 V

Withstands high breakdown voltages, ensuring prolonged protection for devices.

Reference Standard: UL RECOGNIZED

Complies with safety standards for reliable performance and quality assurance.

Technical Specifications

Silicon Surge Protectors TISP7240F3D attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

240 V

Maximum DC Off-state Voltage:

180 V

JEDEC-95 Code:

MS-012AA

JESD-30 Code:

R-PDSO-G8

Non Repetitive Peak On-state Current:

4.3 A

No. of Elements:

3

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP7240F3D Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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