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TISP2380F3SL

Texas Instruments

TISP2380F3SL by Texas Instruments

TISP2380F3SL by Texas Instruments is a silicon surge protector with 3 elements in delta configuration. It has a max breakdown voltage of 380V and can handle non-repetitive peak on-state current of 6A. Ideal for protecting electronic devices from voltage surges, it is UL recognized and features through-hole terminals in a rectangular package shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,471 parts In-Stock

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Digiode

USA . 859 parts In-Stock

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One Stop Electronics

USA . 1,415 parts In-Stock

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$1.100

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$1.100

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Parana Technologies

USA . 1,137 parts In-Stock

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$3.347

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$3.872

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DigiPath Technology Company

USA . 747 parts In-Stock

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$3.686

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747

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ChromeModa Solutions

Germany . 3,374 parts In-Stock

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$3.761

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$3.084

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IDEA Electronic Components Group

UK . 698 parts In-Stock

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$3.761

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$3.385

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AZTECH Wire

Italy . 887 parts In-Stock

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$18.146

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Semicontronic

India . 289 parts In-Stock

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$21.100

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$20.572

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Metaverse IC Inc.

Canada . 4,787 parts In-Stock

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Kepictronics

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Assy Fe

Spain . 3,300 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Corphita

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Corohmni

South Africa . 126 parts In-Stock

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Overview

Protect your valuable electronic devices with the TISP2380F3SL by Texas Instruments, a top-of-the-line Silicon Surge Protector designed to safeguard against voltage spikes and surges. Manufactured by industry leader Texas Instruments, this product offers unmatched quality and reliability. Ideal for a variety of applications, this surge protector is a must-have for any home or office setup. Invest in the TISP2380F3SL today and experience peace of mind knowing your electronics are safe from power disturbances.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the surge protector, ensuring a long lifespan.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements allows for efficient protection against surges and spikes in the electrical system.

Non Repetitive Peak On-state Current: 6 A

With a high peak on-state current rating, this surge protector can effectively handle sudden surges in current without damage.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to install and fit into various electrical setups.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure and reliable connection for the surge protector in the circuit.

No. of Elements: 3

Having 3 elements increases the efficiency and reliability of surge protection in the device.

No. of Terminals: 3

The 3 terminals provide a stable connection in the electrical system for optimal performance.

Package Style (Meter): IN-LINE

The in-line package style allows for easy integration into existing wiring setups.

Maximum DC Off-state Voltage: 270 V

The high off-state voltage rating ensures protection against high voltage spikes in the system.

Trigger Device Type: SILICON SURGE PROTECTOR

Silicon surge protectors are known for their fast response times and high reliability in protecting against voltage spikes.

Terminal Position: SINGLE

The single terminal position simplifies installation and connection of the surge protector in the circuit.

Maximum Breakdown Voltage: 380 V

The high breakdown voltage rating ensures that the surge protector can handle high voltage surges without failing.

Reference Standard: UL RECOGNIZED

Being UL recognized ensures that the surge protector meets the safety and performance standards set by the industry.

Technical Specifications

Silicon Surge Protectors TISP2380F3SL attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

380 V

Maximum DC Off-state Voltage:

270 V

JESD-30 Code:

R-PSIP-T3

Non Repetitive Peak On-state Current:

6 A

No. of Elements:

3

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP2380F3SL Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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