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TIL916

Texas Instruments

TIL916 by Texas Instruments

TIL916 by Texas Instruments is a 4-element optoelectronic device with max forward current of 0.05A, power dissipation of 0.15W, and min current transfer ratio of 500%. It offers fast response time of 0.0001s and high isolation voltage of 3500V, suitable for through hole mounting applications in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,809 parts In-Stock

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4,809

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Digiode

USA . 3,732 parts In-Stock

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3,732

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,207 parts In-Stock

1+ parts

$0.386

100+ parts

-

1k+ parts

$1.580

10k+ parts

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1,207

$0.386

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$1.580

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DigiPath Technology Company

USA . 1,981 parts In-Stock

1+ parts

$0.425

100+ parts

$0.391

1k+ parts

-

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1,981

$0.425

$0.391

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ChromeModa Solutions

Germany . 5,431 parts In-Stock

1+ parts

$0.434

100+ parts

$0.356

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5,431

$0.434

$0.356

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IDEA Electronic Components Group

UK . 235 parts In-Stock

1+ parts

$0.434

100+ parts

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$0.391

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235

$0.434

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$0.391

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Semicontronic

India . 686 parts In-Stock

1+ parts

$1.100

100+ parts

$1.072

1k+ parts

$1.067

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686

$1.100

$1.072

$1.067

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One Stop Electronics

USA . 573 parts In-Stock

1+ parts

$1.100

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573

$1.100

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Ampacity Inc.

Singapore . 1,635 parts In-Stock

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$14.100

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1,635

$14.100

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AZTECH Wire

Italy . 53 parts In-Stock

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$18.263

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53

$18.263

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Corphita

USA . 3,640 parts In-Stock

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3,640

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Corohmni

South Africa . 149 parts In-Stock

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149

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Overview

Elevate your electronic projects with the TIL916 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments brings you a cutting-edge optoelectronic solution that promises exceptional performance and durability. With a high current transfer ratio and fast response time, this product is ideal for a wide range of applications. From industrial automation to consumer electronics, the TIL916 delivers unmatched value and efficiency. Trust Texas Instruments to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Maximum Forward Current: 0.05 A

This high maximum forward current ensures efficient performance and reliability of the optoelectronic device.

Maximum Power Dissipation: 0.15 W

With a low maximum power dissipation, this product helps in minimizing heat generation and energy consumption.

Minimum Current Transfer Ratio: 500 %

The high minimum current transfer ratio ensures accurate and efficient signal transfer within the device.

No. of Elements: 4

Having multiple elements allows for more complex functionalities and versatility in applications.

Maximum Response Time: 0.0001 s

The fast response time of this product allows for quick and timely reactions to input signals.

Maximum Isolation Voltage: 3500 V

The high isolation voltage helps in protecting the device and the circuitry from potential electrical hazards.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mounting feature offers secure and stable installation of the optoelectronic device on the circuit board.

Maximum Forward Voltage: 1.4 V

The low maximum forward voltage helps in reducing power consumption and improving energy efficiency of the device.

Technical Specifications

Other Function Optoelectronics TIL916 attributes and parameters. Explore more Other Function Optoelectronics devices from Texas Instruments

Specs

Minimum Current Transfer Ratio:

500 %

Maximum Forward Current:

.05 A

Maximum Forward Voltage:

1.4 V

Maximum Isolation Voltage:

3500 V

Mounting Feature:

No. of Elements:

4

Maximum Power Dissipation:

.15 W

Maximum Response Time:

.0001 s

Sub-Category:

Optocoupler - Transistor Outputs

Trade Compliance

TIL916 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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