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TIL913B

Texas Instruments

TIL913B by Texas Instruments

TIL913B by Texas Instruments features 0.05A max forward current, 100% min current transfer ratio, and 3500V max isolation voltage. Ideal for optoelectronic applications with THROUGH HOLE MOUNT feature, it offers fast response time of 0.000015s and low forward voltage of 1.4V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,647 parts In-Stock

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6,647

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Digiode

USA . 4,184 parts In-Stock

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4,184

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 588 parts In-Stock

1+ parts

$0.633

100+ parts

-

1k+ parts

$1.699

10k+ parts

-

588

$0.633

-

$1.699

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DigiPath Technology Company

USA . 1,079 parts In-Stock

1+ parts

$0.697

100+ parts

$0.641

1k+ parts

-

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1,079

$0.697

$0.641

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IDEA Electronic Components Group

UK . 475 parts In-Stock

1+ parts

$0.711

100+ parts

-

1k+ parts

$0.640

10k+ parts

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475

$0.711

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$0.640

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ChromeModa Solutions

Germany . 275 parts In-Stock

1+ parts

$0.711

100+ parts

$0.583

1k+ parts

-

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275

$0.711

$0.583

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One Stop Electronics

USA . 181 parts In-Stock

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$1.100

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181

$1.100

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Semicontronic

India . 444 parts In-Stock

1+ parts

$6.100

100+ parts

$5.948

1k+ parts

$5.917

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444

$6.100

$5.948

$5.917

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AZTECH Wire

Italy . 659 parts In-Stock

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$11.946

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659

$11.946

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Corphita

USA . 3,091 parts In-Stock

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3,091

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Corohmni

South Africa . 422 parts In-Stock

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422

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Overview

With the TIL913B by Texas Instruments, you can trust in the quality and reliability of a reputable manufacturer. This optoelectronic component offers a wide range of applications, providing maximum forward current of 0.05 A and minimum current transfer ratio of 100%. Whether you're designing circuit boards or working on industrial automation, this product's through hole mounting feature and high isolation voltage of 3500 V ensure optimal performance. Experience the value and benefits of Texas Instruments' TIL913B for all your optoelectronic needs.

Feature Benefit Bullets

Maximum Forward Current: 0.05 A

This product can handle a maximum forward current of 0.05 A, making it suitable for applications requiring low power consumption.

Maximum Power Dissipation: 0.15 W

With a maximum power dissipation of 0.15 W, this product is efficient and can operate within a specified power range without overheating.

Minimum Current Transfer Ratio: 100%

The minimum current transfer ratio of 100% ensures accurate and reliable signal transmission, making this product ideal for precision applications.

No. of Elements: 2

Having 2 elements increases the versatility of the product, allowing for more complex functionality and applications in various setups.

Maximum Response Time: 0.000015 s

With a fast response time of 0.000015 s, this product can quickly react to input signals, making it suitable for applications that require rapid switching.

Maximum Isolation Voltage: 3500 V

The high isolation voltage of 3500 V ensures safety and protection against electrical interference, making this product reliable in high voltage environments.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mounting feature provides secure and stable installation, making it easy to integrate this product into existing circuitry.

Maximum Forward Voltage: 1.4 V

With a maximum forward voltage of 1.4 V, this product offers efficient energy conversion and can be used in low voltage applications.

Technical Specifications

Other Function Optoelectronics TIL913B attributes and parameters. Explore more Other Function Optoelectronics devices from Texas Instruments

Specs

Minimum Current Transfer Ratio:

100 %

Maximum Forward Current:

.05 A

Maximum Forward Voltage:

1.4 V

Maximum Isolation Voltage:

3500 V

Mounting Feature:

No. of Elements:

2

Maximum Power Dissipation:

.15 W

Maximum Response Time:

.000015 s

Sub-Category:

Optocoupler - Transistor Outputs

Trade Compliance

TIL913B Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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