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TIL916B

Texas Instruments

TIL916B by Texas Instruments

TIL916B by Texas Instruments is a 4-element optoelectronic device with a min current transfer ratio of 1500%. It has a max forward current of 0.05A and power dissipation of 0.15W, suitable for applications requiring fast response times and high isolation voltage up to 3500V. Ideal for through-hole mounting in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,591 parts In-Stock

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8,591

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Digiode

USA . 4,886 parts In-Stock

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4,886

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Distributors (Availability)

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Parana Technologies

USA . 44 parts In-Stock

1+ parts

$0.659

100+ parts

-

1k+ parts

$1.713

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44

$0.659

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$1.713

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ChromeModa Solutions

Germany . 3,741 parts In-Stock

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$0.740

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$0.607

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3,741

$0.740

$0.607

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IDEA Electronic Components Group

UK . 1,543 parts In-Stock

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$0.740

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$0.666

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1,543

$0.740

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$0.666

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Semicontronic

India . 525 parts In-Stock

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$2.100

100+ parts

$2.048

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$2.037

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525

$2.100

$2.048

$2.037

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One Stop Electronics

USA . 240 parts In-Stock

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$3.100

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240

$3.100

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AZTECH Wire

Italy . 609 parts In-Stock

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$6.919

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609

$6.919

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Ampacity Inc.

Singapore . 464 parts In-Stock

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$11.100

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464

$11.100

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Corphita

USA . 4,663 parts In-Stock

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Corohmni

South Africa . 228 parts In-Stock

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DigiPath Technology Company

USA . 54 parts In-Stock

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$0.667

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54

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$0.667

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Overview

Elevate your projects with the TIL916B by Texas Instruments, a top-quality optoelectronic component that delivers reliable performance and precision. Manufactured by the renowned Texas Instruments, this product offers unparalleled value and benefits to customers in a wide range of applications. With a high minimum current transfer ratio and maximum isolation voltage, this component ensures optimal efficiency and safety. Upgrade your designs with the TIL916B and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Maximum Forward Current: 0.05 A

The low maximum forward current allows for efficient power usage and reduces the risk of overheating, making this product a reliable choice for long-term use.

Maximum Power Dissipation: 0.15 W

With a low maximum power dissipation, this product is energy-efficient and can help lower overall power consumption in a circuit or system.

Minimum Current Transfer Ratio: 1500 %

The high minimum current transfer ratio ensures accurate and reliable data transmission, making this product suitable for applications requiring precise signal processing.

No. of Elements: 4

Having four elements provides redundancy and increases the reliability of the product, making it a suitable choice for critical systems where continuous operation is essential.

Maximum Response Time: 0.0001 s

The fast maximum response time allows for quick data transmission and processing, making this product ideal for applications requiring real-time performance.

Maximum Isolation Voltage: 3500 V

The high maximum isolation voltage ensures that the product can safely operate in high-voltage environments without the risk of electrical hazards, making it a versatile and robust choice for various applications.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature allows for secure and stable installation, providing mechanical stability and reliability in harsh operating conditions.

Maximum Forward Voltage: 1.4 V

The low maximum forward voltage helps minimize power consumption and heat generation, making this product an energy-efficient and cost-effective solution for various optoelectronic applications.

Technical Specifications

Other Function Optoelectronics TIL916B attributes and parameters. Explore more Other Function Optoelectronics devices from Texas Instruments

Specs

Minimum Current Transfer Ratio:

1500 %

Maximum Forward Current:

.05 A

Maximum Forward Voltage:

1.4 V

Maximum Isolation Voltage:

3500 V

Mounting Feature:

No. of Elements:

4

Maximum Power Dissipation:

.15 W

Maximum Response Time:

.0001 s

Sub-Category:

Optocoupler - Transistor Outputs

Trade Compliance

TIL916B Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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