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TIL915B

Texas Instruments

TIL915B by Texas Instruments

TIL915B by Texas Instruments is a dual-element optoelectronic device with 0.05A max forward current, 1500% min current transfer ratio, and 1.4V max forward voltage. It offers fast response time of 0.0001s and high isolation voltage of 3500V, making it ideal for through-hole mounting applications requiring precise signal transmission in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,313 parts In-Stock

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7,313

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Digiode

USA . 3,468 parts In-Stock

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3,468

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Distributors (Availability)

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Parana Technologies

USA . 2,197 parts In-Stock

1+ parts

$0.463

100+ parts

-

1k+ parts

$1.612

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2,197

$0.463

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$1.612

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ChromeModa Solutions

Germany . 3,811 parts In-Stock

1+ parts

$0.520

100+ parts

$0.426

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3,811

$0.520

$0.426

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IDEA Electronic Components Group

UK . 1,479 parts In-Stock

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$0.520

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$0.468

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1,479

$0.520

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$0.468

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Ampacity Inc.

Singapore . 1,614 parts In-Stock

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$3.100

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1,614

$3.100

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AZTECH Wire

Italy . 491 parts In-Stock

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$5.315

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491

$5.315

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Semicontronic

India . 446 parts In-Stock

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$18.100

100+ parts

$17.648

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$17.557

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446

$18.100

$17.648

$17.557

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One Stop Electronics

USA . 1,297 parts In-Stock

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$20.100

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$20.100

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DigiPath Technology Company

USA . 1,718 parts In-Stock

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$0.469

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1,718

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$0.469

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Corphita

USA . 1,037 parts In-Stock

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Corohmni

South Africa . 301 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the TIL915B optoelectronic device. Designed for a wide range of applications, this product offers unmatched performance and efficiency. With a minimum current transfer ratio of 1500% and maximum isolation voltage of 3500V, customers can trust in the safety and precision of this component. Whether used in industrial automation, medical equipment, or telecommunications, the TIL915B delivers exceptional value and benefits to users looking for top-tier functionality. Trust in Texas Instruments for all your optoelectronic needs.

Feature Benefit Bullets

Maximum Forward Current: 0.05 A

The low forward current requirement ensures efficient power usage and minimizes heat generation, making this product ideal for use in energy-efficient applications.

Maximum Power Dissipation: 0.15 W

With a low power dissipation value, this product is suitable for use in compact and heat-sensitive applications.

Minimum Current Transfer Ratio: 1500%

The high current transfer ratio indicates strong signal amplification capabilities, making this product suitable for applications requiring high sensitivity to input signals.

No. of Elements: 2

Having two elements increases the versatility and functionality of the optoelectronic device, allowing for more complex operations and applications.

Maximum Response Time: 0.0001 s

The fast response time ensures rapid operation and quick signal processing, making this product ideal for time-sensitive applications.

Maximum Isolation Voltage: 3500 V

The high isolation voltage capability ensures reliable separation of circuits and components, making this product suitable for high-voltage applications where safety is paramount.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mounting feature provides secure and stable installation, making this product suitable for applications where vibration or movement may occur.

Maximum Forward Voltage: 1.4 V

The low forward voltage drop helps minimize power loss and energy consumption, making this product efficient for use in low-power applications.

Technical Specifications

Other Function Optoelectronics TIL915B attributes and parameters. Explore more Other Function Optoelectronics devices from Texas Instruments

Specs

Minimum Current Transfer Ratio:

1500 %

Maximum Forward Current:

.05 A

Maximum Forward Voltage:

1.4 V

Maximum Isolation Voltage:

3500 V

Mounting Feature:

No. of Elements:

2

Maximum Power Dissipation:

.15 W

Maximum Response Time:

.0001 s

Sub-Category:

Optocoupler - Transistor Outputs

Trade Compliance

TIL915B Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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