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TIL913

Texas Instruments

TIL913 by Texas Instruments

TIL913 by Texas Instruments is a 2-element optoelectronic device with max forward current of 0.05A, power dissipation of 0.15W, and min current transfer ratio of 20%. It offers fast response time of 0.000015s and high isolation voltage of 3500V, suitable for through-hole mounting applications in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,733 parts In-Stock

1+ parts

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3,733

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Digiode

USA . 1,640 parts In-Stock

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1,640

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 353 parts In-Stock

1+ parts

$0.031

100+ parts

-

1k+ parts

$1.418

10k+ parts

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353

$0.031

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$1.418

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DigiPath Technology Company

USA . 241 parts In-Stock

1+ parts

$0.034

100+ parts

$0.032

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-

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241

$0.034

$0.032

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ChromeModa Solutions

Germany . 3,494 parts In-Stock

1+ parts

$0.035

100+ parts

$0.029

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3,494

$0.035

$0.029

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IDEA Electronic Components Group

UK . 2,218 parts In-Stock

1+ parts

$0.035

100+ parts

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$0.032

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2,218

$0.035

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$0.032

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AZTECH Wire

Italy . 198 parts In-Stock

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$8.456

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198

$8.456

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One Stop Electronics

USA . 1,228 parts In-Stock

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$11.100

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1,228

$11.100

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Semicontronic

India . 1,551 parts In-Stock

1+ parts

$13.100

100+ parts

$12.772

1k+ parts

$12.707

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1,551

$13.100

$12.772

$12.707

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Ampacity Inc.

Singapore . 968 parts In-Stock

1+ parts

$14.100

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968

$14.100

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Corphita

USA . 4,920 parts In-Stock

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4,920

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Corohmni

South Africa . 265 parts In-Stock

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265

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Overview

Enhance your electronics projects with the TIL913 from Texas Instruments, a leading manufacturer known for top-quality components. This optoelectronic device offers a maximum forward current of 0.05 A and a minimum current transfer ratio of 20%. With a quick response time of 0.000015 s and a high isolation voltage of 3500 V, the TIL913 is perfect for applications requiring reliable signal transmission. Upgrade your designs with this through-hole mount component that provides exceptional performance and value.

Feature Benefit Bullets

Maximum Forward Current: 0.05 A

With a high maximum forward current, this product can handle heavy load currents effectively, making it reliable for various applications.

Maximum Power Dissipation: 0.15 W

The low power dissipation of this product ensures minimal heat generation and energy efficiency, making it suitable for continuous operation without overheating.

Minimum Current Transfer Ratio: 20 %

The high current transfer ratio indicates efficient signal transmission capabilities, ensuring accurate and reliable operation of this optoelectronic component.

No. of Elements: 2

Having multiple elements allows for more versatile usage and potential for complex circuit designs, increasing the functionality and flexibility of this product.

Maximum Response Time: 0.000015 s

The ultra-fast response time of this product enables quick signal processing, making it ideal for high-speed applications where timely operation is crucial.

Maximum Isolation Voltage: 3500 V

The high isolation voltage rating ensures effective electrical insulation and protection, making this product suitable for use in high-voltage environments without risk of short circuits.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature provides secure and stable installation of this optoelectronic component on a PCB, ensuring reliable performance and longevity in various electronic devices.

Maximum Forward Voltage: 1.4 V

With a low forward voltage drop, this product operates efficiently and effectively, minimizing power loss and maximizing energy conversion, making it a cost-effective choice for optoelectronic applications.

Technical Specifications

Other Function Optoelectronics TIL913 attributes and parameters. Explore more Other Function Optoelectronics devices from Texas Instruments

Specs

Minimum Current Transfer Ratio:

20 %

Maximum Forward Current:

.05 A

Maximum Forward Voltage:

1.4 V

Maximum Isolation Voltage:

3500 V

Mounting Feature:

No. of Elements:

2

Maximum Power Dissipation:

.15 W

Maximum Response Time:

.000015 s

Sub-Category:

Optocoupler - Transistor Outputs

Trade Compliance

TIL913 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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