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TIL300ADCS

Texas Instruments

TIL300ADCS by Texas Instruments

OPTOELECTRONIC DEVICE; Maximum Operating Temperature: 100 Cel; Configuration: DUAL, SIMULTANEOUS OPERATION; Minimum Operating Temperature: -55 Cel; No. of Functions: 1;

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,530 parts In-Stock

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7,530

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Digiode

USA . 1,003 parts In-Stock

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1,003

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Electronics Depot

USA . 500 parts In-Stock

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500

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Bristol Electronics

USA . 272 parts In-Stock

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272

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Atlantic Semiconductor

USA . 272 parts In-Stock

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Odi Ramu Company

Canada . 38 parts In-Stock

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38

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,291 parts In-Stock

1+ parts

$0.386

100+ parts

-

1k+ parts

$1.580

10k+ parts

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1,291

$0.386

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$1.580

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DigiPath Technology Company

USA . 480 parts In-Stock

1+ parts

$0.425

100+ parts

$0.391

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480

$0.425

$0.391

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ChromeModa Solutions

Germany . 2,849 parts In-Stock

1+ parts

$0.434

100+ parts

$0.356

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2,849

$0.434

$0.356

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IDEA Electronic Components Group

UK . 1,950 parts In-Stock

1+ parts

$0.434

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$0.391

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1,950

$0.434

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$0.391

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AZTECH Wire

Italy . 597 parts In-Stock

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$6.028

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597

$6.028

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One Stop Electronics

USA . 1,162 parts In-Stock

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$14.100

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1,162

$14.100

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Corphita

USA . 71 parts In-Stock

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Technical Specifications

Other Function Optoelectronics TIL300ADCS attributes and parameters. Explore more Other Function Optoelectronics devices from Texas Instruments

Specs

Configuration:

DUAL, SIMULTANEOUS OPERATION

No. of Functions:

1

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-55 Cel

Optoelectronic Type:

Trade Compliance

TIL300ADCS Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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