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TAS5504APAGG4

Texas Instruments

TAS5504APAGG4 by Texas Instruments

TAS5504APAGG4 by Texas Instruments is a 64-terminal IC with 3.3V power supply, suitable for consumer circuits. It features a flatpack package style, nickel palladium gold terminal finish, and operates b/w 0-70°C. Ideal for applications requiring a compact design and high performance in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,420

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-

-

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Digiode

USA . 865 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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865

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 996 parts In-Stock

1+ parts

$2.681

100+ parts

-

1k+ parts

$3.165

10k+ parts

-

996

$2.681

-

$3.165

-

DigiPath Technology Company

USA . 91 parts In-Stock

1+ parts

$2.952

100+ parts

$2.716

1k+ parts

-

10k+ parts

-

91

$2.952

$2.716

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ChromeModa Solutions

Germany . 4,781 parts In-Stock

1+ parts

$3.012

100+ parts

$2.470

1k+ parts

-

10k+ parts

-

4,781

$3.012

$2.470

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-

IDEA Electronic Components Group

UK . 2,087 parts In-Stock

1+ parts

$3.012

100+ parts

-

1k+ parts

$2.711

10k+ parts

-

2,087

$3.012

-

$2.711

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One Stop Electronics

USA . 336 parts In-Stock

1+ parts

$7.800

100+ parts

-

1k+ parts

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10k+ parts

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336

$7.800

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-

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AZTECH Wire

Italy . 473 parts In-Stock

1+ parts

$11.334

100+ parts

-

1k+ parts

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10k+ parts

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473

$11.334

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Corphita

USA . 795 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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795

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Microchip USA

USA . 224 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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224

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Overview

Elevate your consumer electronic designs with the high-quality TAS5504APAGG4 by Texas Instruments. Known for their superior manufacturing standards, Texas Instruments delivers top-of-the-line components for various applications. This versatile IC offers unmatched value, providing customers with reliable performance and innovative features. Whether you're designing audio systems, control panels, or other consumer electronics, the TAS5504APAGG4 is the perfect choice to enhance functionality and efficiency. Trust Texas Instruments to deliver excellence in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is commonly used for consumer ICs due to its durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for easy installation and efficient use of PCB space.

Package Shape: SQUARE

Square packages are compact and space-saving, making them ideal for consumer electronics.

Power Supplies (V): 3.3

Compatible with standard 3.3V power supplies, ensuring compatibility with a wide range of electronic devices.

No. of Terminals: 64

High number of terminals allow for versatile connectivity options and functionality.

Width: 10 mm

Compact width makes it suitable for small form factor devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in typical consumer electronics environments.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical and electrical connections, increasing the durability of the product.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates that the product is suitable for standard manufacturing and handling processes.

Technical Specifications

Other Function Consumer ICs TAS5504APAGG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TAS5504APAGG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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