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TAS5504APAG

Texas Instruments

TAS5504APAG by Texas Instruments

TAS5504APAG by Texas Instruments is a 64-terminal IC with 3.3V power supply, suitable for consumer circuits. It features a flatpack package style, operates b/w 0-70°C, and has a terminal finish of nickel palladium gold. Ideal for applications requiring thin profile and fine pitch packaging.

Median Price

$8.770

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.190

10k+ parts

$7.758

480

-

-

$8.190

$7.758

Rochester

USA . 147 parts In-Stock

1+ parts

-

100+ parts

$7.480

1k+ parts

$6.690

10k+ parts

$6.300

147

-

$7.480

$6.690

$6.300

DigiKey

USA . 147 parts In-Stock

1+ parts

-

100+ parts

$9.840

1k+ parts

-

10k+ parts

-

147

-

$9.840

-

-

Verical

USA . 101 parts In-Stock

1+ parts

-

100+ parts

$9.350

1k+ parts

$8.363

10k+ parts

$7.875

101

-

$9.350

$8.363

$7.875

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,333 parts In-Stock

1+ parts

$7.372

100+ parts

-

1k+ parts

-

10k+ parts

-

3,333

$7.372

-

-

-

Vyrian

USA . 5,252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,252

-

-

-

-

TME

Poland . 480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.965

10k+ parts

-

480

-

-

$8.965

-

DigiKey Marketplace

USA . 166 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

166

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 81 parts In-Stock

1+ parts

$1.198

100+ parts

-

1k+ parts

$1.995

10k+ parts

-

81

$1.198

-

$1.995

-

DigiPath Technology Company

USA . 2,181 parts In-Stock

1+ parts

$1.319

100+ parts

-

1k+ parts

-

10k+ parts

-

2,181

$1.319

-

-

-

ChromeModa Solutions

Germany . 6,244 parts In-Stock

1+ parts

$1.346

100+ parts

$1.104

1k+ parts

-

10k+ parts

-

6,244

$1.346

$1.104

-

-

IDEA Electronic Components Group

UK . 821 parts In-Stock

1+ parts

$1.346

100+ parts

-

1k+ parts

$1.211

10k+ parts

-

821

$1.346

-

$1.211

-

Ampacity Inc.

Singapore . 207 parts In-Stock

1+ parts

$6.600

100+ parts

-

1k+ parts

-

10k+ parts

-

207

$6.600

-

-

-

Corphita

USA . 705 parts In-Stock

1+ parts

$6.984

100+ parts

-

1k+ parts

-

10k+ parts

-

705

$6.984

-

-

-

Microchip USA

USA . 291 parts In-Stock

1+ parts

$23.830

100+ parts

$23.660

1k+ parts

$23.660

10k+ parts

$23.490

291

$23.830

$23.660

$23.660

$23.490

A-Z Elektronik GmbH

Germany . 6,758 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,758

-

-

-

-

Overview

Discover the innovative TAS5504APAG by Texas Instruments, a high-quality consumer IC that brings reliability and performance to your electronic designs. With a sleek square package body and advanced features, this versatile IC is perfect for a wide range of applications. From audio equipment to smart home devices, the TAS5504APAG offers value, efficiency, and precision that will elevate your products to the next level. Trust in Texas Instruments for cutting-edge technology that delivers exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the IC, making it suitable for various consumer applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing manufacturing costs.

Package Shape: SQUARE

The square shape helps in optimizing layout and space utilization on the PCB, enhancing overall design efficiency.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V makes this IC compatible with a wide range of systems and devices.

No. of Terminals: 64

Having a high number of terminals allows for more connectivity options and features in the IC, increasing its functionality.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

This package style offers space-saving benefits and facilitates high-density mounting on PCBs, ideal for compact consumer electronics.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and ensure reliable performance.

Minimum Operating Temperature: 0 °C

The wide temperature range allows the IC to operate effectively in various temperature environments, ensuring versatility and reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: QUAD

Quad terminal positioning allows for efficient soldering and connection, enhancing the overall reliability of the IC.

Maximum Seated Height: 1.2 mm

The low seated height makes this IC suitable for compact designs and slim form factors, enabling sleek and space-efficient electronic devices.

Width: 10 mm

The compact width of the IC allows for flexible placement and integration into various electronic systems, offering design versatility.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage requirement ensures compatibility with a wide range of power sources, making it easier to integrate into different systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum reflow time ensures proper soldering and manufacturing processes, contributing to the overall reliability and quality of the IC.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for reliable soldering connections, ensuring robust performance under various operating conditions.

Length: 10 mm

The compact length of the IC enables efficient use of space on the PCB, contributing to a streamlined and optimized design layout.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this IC meets industry standards for performance and reliability, making it a dependable choice for consumer electronics.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and mounting onto PCBs, ensuring secure connections and efficient assembly processes.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting and efficient use of PCB space, making this IC suitable for compact and miniaturized designs.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this IC can withstand moderate exposure to moisture during storage and handling, ensuring long-term reliability.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage capability provides flexibility in power source options and ensures compatibility with a wide range of systems and devices.

Technical Specifications

Other Function Consumer ICs TAS5504APAG attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TAS5504APAG General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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