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TAS5066PAGRG4

Texas Instruments

TAS5066PAGRG4 by Texas Instruments

TAS5066PAGRG4 by Texas Instruments is a 64-terminal consumer IC with 3.3V power supply, operating b/w 0-70°C. It features a flatpack package style and is suitable for various consumer circuit applications requiring a min supply voltage of 3V and max supply voltage of 3.6V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,005 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,005

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-

-

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Vyrian

USA . 2,654 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,654

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 217 parts In-Stock

1+ parts

$0.460

100+ parts

$42.730

1k+ parts

$0.414

10k+ parts

-

217

$0.460

$42.730

$0.414

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DigiPath Technology Company

USA . 1,971 parts In-Stock

1+ parts

$0.507

100+ parts

$0.466

1k+ parts

-

10k+ parts

-

1,971

$0.507

$0.466

-

-

ChromeModa Solutions

Germany . 3,915 parts In-Stock

1+ parts

$0.517

100+ parts

$0.424

1k+ parts

-

10k+ parts

-

3,915

$0.517

$0.424

-

-

IDEA Electronic Components Group

UK . 1,047 parts In-Stock

1+ parts

$0.517

100+ parts

-

1k+ parts

$0.465

10k+ parts

-

1,047

$0.517

-

$0.465

-

AZTECH Wire

Italy . 338 parts In-Stock

1+ parts

$5.156

100+ parts

-

1k+ parts

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10k+ parts

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338

$5.156

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-

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One Stop Electronics

USA . 690 parts In-Stock

1+ parts

$11.800

100+ parts

-

1k+ parts

-

10k+ parts

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690

$11.800

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-

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Component Stockers USA

USA . 695 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

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10k+ parts

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695

$99.990

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Corphita

USA . 4,537 parts In-Stock

1+ parts

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100+ parts

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4,537

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Microchip USA

USA . 201 parts In-Stock

1+ parts

-

100+ parts

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201

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Overview

Elevate your consumer electronic designs with the TAS5066PAGRG4 by Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments delivers cutting-edge solutions in the Other Function Consumer ICs category. This versatile IC offers a wide range of applications, providing customers with value, efficiency, and performance like never before. Say goodbye to compromises and hello to innovation with the TAS5066PAGRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the IC lightweight and durable, which is ideal for consumer electronic devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto PCBs, saving time and reducing manufacturing costs.

Power Supplies (V): 3.3

With a power supply of 3.3V, this IC is suitable for various consumer electronic applications without requiring additional voltage regulation.

No. of Terminals: 64

Having 64 terminals provides a large number of connections, allowing for versatile functionality and compatibility with different circuit designs.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes this IC suitable for a wide range of environments and applications.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this IC can withstand the soldering process during assembly without damage.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature ranges ensures reliability and performance in typical consumer electronic devices.

Moisture Sensitivity Level (MSL): 4

Having MSL 4 indicates that this IC is moderately sensitive to moisture, ensuring proper handling and storage procedures are followed during manufacturing.

Technical Specifications

Other Function Consumer ICs TAS5066PAGRG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TAS5066PAGRG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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