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SNJ54LVT574FK

Texas Instruments

SNJ54LVT574FK by Texas Instruments

SNJ54LVT574FK by Texas Instruments is an 8-bit bus driver with a propagation delay of 6.1 ns and operates at a supply voltage of 3.3V. It features a MILITARY temperature grade, TRUE output polarity, and is ideal for applications requiring fast signal transmission in harsh environments.

Median Price

$10.675

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 214 parts In-Stock

1+ parts

-

100+ parts

$8.540

1k+ parts

$7.640

10k+ parts

$7.190

214

-

$8.540

$7.640

$7.190

DigiKey

USA . 214 parts In-Stock

1+ parts

-

100+ parts

$11.240

1k+ parts

-

10k+ parts

-

214

-

$11.240

-

-

Verical

USA . 214 parts In-Stock

1+ parts

-

100+ parts

$10.675

1k+ parts

$9.550

10k+ parts

$8.988

214

-

$10.675

$9.550

$8.988

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,705 parts In-Stock

1+ parts

$9.016

100+ parts

-

1k+ parts

-

10k+ parts

-

2,705

$9.016

-

-

-

Vyrian

USA . 4,528 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,528

-

-

-

-

DigiKey Marketplace

USA . 214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

214

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,796 parts In-Stock

1+ parts

$2.596

100+ parts

-

1k+ parts

$2.492

10k+ parts

$2.492

2,796

$2.596

-

$2.492

$2.492

Corphita

USA . 3,049 parts In-Stock

1+ parts

$8.541

100+ parts

-

1k+ parts

-

10k+ parts

-

3,049

$8.541

-

-

-

Parana Technologies

USA . 1,446 parts In-Stock

1+ parts

$15.675

100+ parts

-

1k+ parts

$16.044

10k+ parts

-

1,446

$15.675

-

$16.044

-

DigiPath Technology Company

USA . 1,918 parts In-Stock

1+ parts

$17.260

100+ parts

$15.879

1k+ parts

-

10k+ parts

-

1,918

$17.260

$15.879

-

-

IDEA Electronic Components Group

UK . 1,735 parts In-Stock

1+ parts

$17.612

100+ parts

$16.731

1k+ parts

$15.851

10k+ parts

-

1,735

$17.612

$16.731

$15.851

-

ChromeModa Solutions

Germany . 734 parts In-Stock

1+ parts

$17.612

100+ parts

$14.442

1k+ parts

-

10k+ parts

-

734

$17.612

$14.442

-

-

Kepictronics

USA . 214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

214

-

-

-

-

Overview

Unlock the power of seamless data transmission with the SNJ54LVT574FK by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability in their Bus Driver & Transceivers category. This versatile chip carrier package is perfect for a wide range of applications, providing fast propagation delay and 3-STATE output characteristics. Trust in Texas Instruments to provide you with the cutting-edge technology you need for your projects. Elevate your designs with the SNJ54LVT574FK and experience the difference in performance and efficiency it brings to your work.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides excellent durability and resistance to harsh environments, making this product suitable for rugged applications.

Propagation Delay At Nominal Supply: 6.1 ns

Low propagation delay ensures fast and efficient data transmission, making this product ideal for high-speed communication systems.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

No. of Bits: 8

Offers sufficient data width for handling various communication protocols and interfaces.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltages, ensuring seamless integration into existing systems.

Output Characteristics: 3-STATE

Allows for tri-state output control, enabling efficient bus sharing and communication between multiple devices.

Technology: BICMOS

Combines the advantages of bipolar and CMOS technologies, providing high performance with low power consumption.

Technical Specifications

Bus Driver & Transceivers SNJ54LVT574FK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 374

Family:

LVT

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

48 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

14 mA

Propagation Delay At Nominal Supply:

6.1 ns

Propagation Delay (tpd):

6.8 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

8.89 mm

Trade Compliance

SNJ54LVT574FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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