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SNJ54LVC574AW

Texas Instruments

SNJ54LVC574AW by Texas Instruments

SNJ54LVC574AW by Texas Instruments is an 8-bit bus driver with a propagation delay of 7ns at 2.7V, suitable for military applications. It features a max frequency of 150MHz, operates b/w -55 to 125°C, and has a low power supply current of 0.01mA. The device offers true output polarity and positive edge triggering in a compact flatpack package.

Median Price

$39.203

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,576 parts In-Stock

1+ parts

$39.203

100+ parts

$34.847

1k+ parts

$25.623

10k+ parts

-

3,576

$39.203

$34.847

$25.623

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,565 parts In-Stock

1+ parts

$37.243

100+ parts

-

1k+ parts

-

10k+ parts

-

1,565

$37.243

-

-

-

Vyrian

USA . 7,118 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,118

-

-

-

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Sogenti Electronics

Canada . 34 parts In-Stock

1+ parts

-

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-

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34

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,926 parts In-Stock

1+ parts

$7.186

100+ parts

-

1k+ parts

$6.899

10k+ parts

$6.899

3,926

$7.186

-

$6.899

$6.899

AZTECH Wire

Italy . 546 parts In-Stock

1+ parts

$18.800

100+ parts

-

1k+ parts

-

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546

$18.800

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-

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Parana Technologies

USA . 2,357 parts In-Stock

1+ parts

$20.240

100+ parts

-

1k+ parts

$20.230

10k+ parts

-

2,357

$20.240

-

$20.230

-

ChromeModa Solutions

Germany . 2,109 parts In-Stock

1+ parts

$22.742

100+ parts

$18.648

1k+ parts

-

10k+ parts

-

2,109

$22.742

$18.648

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IDEA Electronic Components Group

UK . 777 parts In-Stock

1+ parts

$22.742

100+ parts

$21.605

1k+ parts

$20.468

10k+ parts

-

777

$22.742

$21.605

$20.468

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Corphita

USA . 2,812 parts In-Stock

1+ parts

$35.283

100+ parts

-

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2,812

$35.283

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DigiPath Technology Company

USA . 2,363 parts In-Stock

1+ parts

-

100+ parts

$20.504

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-

10k+ parts

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2,363

-

$20.504

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Microchip USA

USA . 1,031 parts In-Stock

1+ parts

-

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1,031

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Kepictronics

USA . 108 parts In-Stock

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108

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Overview

Discover the unmatched quality and reliability of the SNJ54LVC574AW by Texas Instruments, setting the standard in bus drivers and transceivers. With a MILITARY-grade screening level and 3-STATE output characteristics, this product offers superior performance in a wide range of applications. From its ceramic, glass-sealed package to its high-speed propagation delay, customers can trust in the value and benefits this product brings to their projects. Experience the advantage of Texas Instruments technology with the SNJ54LVC574AW.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed packaging provides durability and protection for the internal components of the product, ensuring reliable performance in various environments.

Propagation Delay At Nominal Supply: 7 ns

The low propagation delay of 7 ns at nominal supply helps in fast transmission of signals, making this product suitable for applications requiring quick response times.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 2.7

The low nominal supply voltage of 2.7V makes this product energy efficient and compatible with low power applications.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high noise immunity, and compatibility with a wide range of operating voltages, making it a reliable choice for various applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures the product can withstand harsh environmental conditions and operate reliably in elevated temperature environments.

Technical Specifications

Bus Driver & Transceivers SNJ54LVC574AW attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-GDFP-F16

JESD-609 Code:

e0

Length:

10.16 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL20,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

6.73 mm

Trade Compliance

SNJ54LVC574AW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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