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SNJ54LVC573AJ

Texas Instruments

SNJ54LVC573AJ by Texas Instruments

SNJ54LVC573AJ by Texas Instruments is an 8-bit bus driver with a propagation delay of 6.9 ns at 3.3V, suitable for military-grade applications. It features a max operating temperature of 125°C, output polarity TRUE, and a terminal finish of Tin/Lead (Sn/Pb).

Median Price

$29.482

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,362 parts In-Stock

1+ parts

$29.482

100+ parts

$26.206

1k+ parts

$19.269

10k+ parts

-

2,362

$29.482

$26.206

$19.269

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,103 parts In-Stock

1+ parts

$28.008

100+ parts

-

1k+ parts

-

10k+ parts

-

4,103

$28.008

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-

-

Vyrian

USA . 7,811 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,811

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 87 parts In-Stock

1+ parts

$8.070

100+ parts

-

1k+ parts

-

10k+ parts

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87

$8.070

-

-

-

Parana Technologies

USA . 1,332 parts In-Stock

1+ parts

$21.734

100+ parts

-

1k+ parts

$22.181

10k+ parts

-

1,332

$21.734

-

$22.181

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IDEA Electronic Components Group

UK . 2,097 parts In-Stock

1+ parts

$24.420

100+ parts

$23.199

1k+ parts

$21.978

10k+ parts

-

2,097

$24.420

$23.199

$21.978

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ChromeModa Solutions

Germany . 917 parts In-Stock

1+ parts

$24.420

100+ parts

$20.024

1k+ parts

-

10k+ parts

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917

$24.420

$20.024

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-

Corphita

USA . 4,480 parts In-Stock

1+ parts

$26.534

100+ parts

-

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4,480

$26.534

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Microchip USA

USA . 11,615 parts In-Stock

1+ parts

-

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11,615

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DigiPath Technology Company

USA . 14 parts In-Stock

1+ parts

-

100+ parts

$22.017

1k+ parts

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14

-

$22.017

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Overview

Upgrade your electronic designs with the SNJ54LVC573AJ by Texas Instruments. With a reputation for superior quality and reliability, Texas Instruments delivers top-of-the-line Bus Driver & Transceivers like this one that offer high performance and efficiency. Ideal for applications requiring precision and speed, this product ensures seamless data transmission while providing customers with unmatched value and benefits. Trust Texas Instruments to elevate your projects to the next level with the SNJ54LVC573AJ.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides excellent protection for the internal components, ensuring durability and reliability in harsh environments.

Propagation Delay At Nominal Supply: 6.9 ns

Fast propagation delay allows for quick signal transmission, making this product suitable for high-speed applications.

Screening Level: MIL-PRF-38535

Compliance with military screening standards ensures high quality and reliability for mission-critical operations.

Output Characteristics: 3-STATE

3-STATE output provides flexibility in controlling the output signal, enabling efficient communication in various scenarios.

Temperature Grade: MILITARY

Designed to operate in extreme temperature conditions, meeting the stringent requirements of military applications.

Technical Specifications

Bus Driver & Transceivers SNJ54LVC573AJ attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 373

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

Length:

24.195 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.9 ns

Propagation Delay (tpd):

8.4 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SNJ54LVC573AJ Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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