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SNJ54LVC573AFK

Texas Instruments

SNJ54LVC573AFK by Texas Instruments

SNJ54LVC573AFK by Texas Instruments is an 8-bit bus driver with a propagation delay of 6.9 ns at 3.3V, suitable for military-grade applications. It features a 3-STATE output and operates within a temperature range of -55 to 125°C, making it ideal for high-reliability systems requiring fast signal transmission. The chip carrier package style with a ceramic body and metal-sealed co-fired material ensures robust performance in harsh environments.

Median Price

$39.800

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,007 parts In-Stock

1+ parts

$39.800

100+ parts

$35.378

1k+ parts

$26.013

10k+ parts

-

2,007

$39.800

$35.378

$26.013

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,747 parts In-Stock

1+ parts

$37.810

100+ parts

-

1k+ parts

-

10k+ parts

-

4,747

$37.810

-

-

-

Vyrian

USA . 8,337 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,337

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,716 parts In-Stock

1+ parts

$2.265

100+ parts

-

1k+ parts

$2.174

10k+ parts

$2.174

3,716

$2.265

-

$2.174

$2.174

AZTECH Wire

Italy . 226 parts In-Stock

1+ parts

$11.840

100+ parts

-

1k+ parts

-

10k+ parts

-

226

$11.840

-

-

-

Parana Technologies

USA . 2,317 parts In-Stock

1+ parts

$23.642

100+ parts

-

1k+ parts

$24.274

10k+ parts

-

2,317

$23.642

-

$24.274

-

DigiPath Technology Company

USA . 2,295 parts In-Stock

1+ parts

$26.033

100+ parts

$23.950

1k+ parts

-

10k+ parts

-

2,295

$26.033

$23.950

-

-

IDEA Electronic Components Group

UK . 753 parts In-Stock

1+ parts

$26.564

100+ parts

$25.236

1k+ parts

$23.908

10k+ parts

-

753

$26.564

$25.236

$23.908

-

ChromeModa Solutions

Germany . 278 parts In-Stock

1+ parts

$26.564

100+ parts

$21.782

1k+ parts

-

10k+ parts

-

278

$26.564

$21.782

-

-

Corphita

USA . 157 parts In-Stock

1+ parts

$35.820

100+ parts

-

1k+ parts

-

10k+ parts

-

157

$35.820

-

-

-

Microchip USA

USA . 1,468 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,468

-

-

-

-

Overview

Experience unparalleled quality and reliability with the SNJ54LVC573AFK by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments offers top-notch bus drivers and transceivers that cater to a wide range of applications. This product stands out for its exceptional value, delivering fast propagation delay and low power consumption. With 8 bits and 3-state output characteristics, customers can trust in the performance and efficiency of this chip carrier package. Upgrade your electronic projects today with the SNJ54LVC573AFK and enjoy seamless operation at a military-grade temperature range.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability, making the product suitable for rugged environments.

Surface Mount: YES

Facilitates easy installation on circuit boards, saving time and effort in the manufacturing process.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a commonly used voltage level, ensuring compatibility with existing systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ideal for applications where heat dissipation is a concern.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, increasing efficiency.

Technical Specifications

Bus Driver & Transceivers SNJ54LVC573AFK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 373

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.9 ns

Propagation Delay (tpd):

8.4 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Trade Compliance

SNJ54LVC573AFK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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