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SNJ54LS682J

Texas Instruments

SNJ54LS682J by Texas Instruments

SNJ54LS682J by Texas Instruments is an 8-bit digital arithmetic circuit with a propagation delay of 30ns at 5V. It features MIL-PRF-38535 screening and operates in a temperature range of -55 to 125°C. This TTL technology chip is commonly used in military applications due to its Schmitt Trigger feature and inverted output polarity.

Median Price

$52.268

Lifecycle Status

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Rochester

USA . 606 parts In-Stock

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$46.460

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$41.570

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$39.130

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DigiKey

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Verical

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$48.913

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Freelance Electronics

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Nova Conductors

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DigiKey Marketplace

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Digiode

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Vyrian

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Sensible Micro Corp

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Manoshevitz Elec. Sales

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Mil-Aero Solutions, Inc.

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Sogenti Electronics

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Odi Ramu Company

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Inland Empire Components Inc.

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Andel Nordic

Denmark . 2,831 parts In-Stock

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$9.181

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Parana Technologies

USA . 2,149 parts In-Stock

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DigiPath Technology Company

USA . 796 parts In-Stock

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IDEA Electronic Components Group

UK . 2,076 parts In-Stock

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ChromeModa Solutions

Germany . 1,310 parts In-Stock

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Corphita

USA . 3,796 parts In-Stock

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Microchip USA

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Overview

Unleash the power of advanced digital arithmetic circuits with the SNJ54LS682J by Texas Instruments. Crafted with precision and expertise, this innovative component offers unmatched performance and reliability for a wide range of applications. From military-grade equipment to industrial automation systems, this versatile chip delivers lightning-fast processing speeds and enhanced accuracy. Experience seamless integration and superior functionality with the SNJ54LS682J, setting new standards in digital circuit technology. Elevate your projects with Texas Instruments' cutting-edge solutions today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package provides durability and protection for the internal components, making the product suitable for rugged environments.

Propagation Delay At Nominal Supply: 30 ns

The low propagation delay ensures fast and efficient operation of the digital arithmetic circuits, making the product suitable for high-speed applications.

Screening Level: MIL-PRF-38535

The MIL-PRF-38535 screening level ensures high reliability and quality of the product, making it suitable for critical military and aerospace applications.

No. of Bits: 8

The 8-bit configuration provides sufficient precision and accuracy for digital arithmetic calculations, making the product suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power sources, making the product easy to integrate into existing systems.

Technical Specifications

Digital Arithmetic Circuits SNJ54LS682J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH PULL-UP RESISTORS ON B INPUTS; WITH A = B & A > B OUTPUTS

Family:

LS

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

Length:

24.195 mm

Load Capacitance (CL):

45 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

70 mA

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

30 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SNJ54LS682J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-197-8704, 5962011978704, 5962-01-248-7307, 5962012487307, 5962-01-293-7111, 5962012937111

NIIN

011978704, 012487307, 012937111

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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