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SNJ54F373FK

Texas Instruments

SNJ54F373FK by Texas Instruments

SNJ54F373FK by Texas Instruments is an 8-bit bus driver with a propagation delay of 8.5 ns at 5V, suitable for military-grade applications. It features a 3-STATE output and operates within a temperature range of -55 to 125°C. With a ceramic, metal-sealed package style, it offers true output polarity and low power supply current requirements.

Median Price

$14.327

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 55 parts In-Stock

1+ parts

-

100+ parts

$13.541

1k+ parts

$12.829

10k+ parts

$12.023

55

-

$13.541

$12.829

$12.023

Rochester

USA . 37 parts In-Stock

1+ parts

-

100+ parts

$12.090

1k+ parts

$10.820

10k+ parts

$10.180

37

-

$12.090

$10.820

$10.180

DigiKey

USA . 37 parts In-Stock

1+ parts

-

100+ parts

$15.910

1k+ parts

-

10k+ parts

-

37

-

$15.910

-

-

Verical

USA . 37 parts In-Stock

1+ parts

-

100+ parts

$15.113

1k+ parts

$13.525

10k+ parts

$12.725

37

-

$15.113

$13.525

$12.725

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,929 parts In-Stock

1+ parts

$11.086

100+ parts

-

1k+ parts

-

10k+ parts

-

1,929

$11.086

-

-

-

Vyrian

USA . 8,631 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,631

-

-

-

-

TME

Poland . 55 parts In-Stock

1+ parts

-

100+ parts

$15.966

1k+ parts

-

10k+ parts

-

55

-

$15.966

-

-

DigiKey Marketplace

USA . 37 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

37

-

-

-

-

ComSIT Distribution GmbH

Germany . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,209 parts In-Stock

1+ parts

$6.025

100+ parts

-

1k+ parts

$5.784

10k+ parts

$5.784

1,209

$6.025

-

$5.784

$5.784

Corphita

USA . 272 parts In-Stock

1+ parts

$10.503

100+ parts

-

1k+ parts

-

10k+ parts

-

272

$10.503

-

-

-

Parana Technologies

USA . 1,029 parts In-Stock

1+ parts

$26.092

100+ parts

-

1k+ parts

$26.681

10k+ parts

-

1,029

$26.092

-

$26.681

-

DigiPath Technology Company

USA . 1,336 parts In-Stock

1+ parts

$28.731

100+ parts

$26.432

1k+ parts

-

10k+ parts

-

1,336

$28.731

$26.432

-

-

ChromeModa Solutions

Germany . 3,645 parts In-Stock

1+ parts

$29.317

100+ parts

$24.040

1k+ parts

-

10k+ parts

-

3,645

$29.317

$24.040

-

-

IDEA Electronic Components Group

UK . 2,124 parts In-Stock

1+ parts

$29.317

100+ parts

$27.851

1k+ parts

$26.385

10k+ parts

-

2,124

$29.317

$27.851

$26.385

-

Microchip USA

USA . 1,615 parts In-Stock

1+ parts

$29.540

100+ parts

$29.120

1k+ parts

$28.910

10k+ parts

$28.700

1,615

$29.540

$29.120

$28.910

$28.700

Overview

Enhance your electronic projects with the Texas Instruments SNJ54F373FK Bus Driver & Transceivers. Crafted with precision using top-quality materials, this chip carrier device offers reliable performance in military-grade applications. With a quick propagation delay of 8.5 ns and true output polarity, it ensures efficient signal transmission with low power consumption. Ideal for unidirectional data flow control, this IC with 8 bits and 3-state output characteristics is a valuable addition to any circuit design, providing unmatched value and functionality to customers seeking high-performance components.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and reliability for the bus driver & transceiver, making it suitable for rugged environments.

Propagation Delay At Nominal Supply: 8.5 ns

The low propagation delay ensures fast signal transmission, making the product ideal for high-speed communication applications.

Surface Mount: YES

The surface mount capability makes installation and replacement of the bus driver & transceiver easy and efficient.

Screening Level: MIL-PRF-38535

Compliance with MIL-PRF-38535 standards ensures that the product meets high reliability and quality requirements for military applications.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes the bus driver & transceiver compatible with a wide range of electronic systems.

Technical Specifications

Bus Driver & Transceivers SNJ54F373FK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

F/FAST

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

55 mA

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

SNJ54F373FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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