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SNJ54BCT2240J

Texas Instruments

SNJ54BCT2240J by Texas Instruments

SNJ54BCT2240J by Texas Instruments is a 20-terminal bus driver with 6.3 ns propagation delay, suitable for military-grade applications. It features 2 functions, operates at a supply voltage of 5V, and has a max operating temperature of 125°C. The device offers inverted output polarity and is designed for unidirectional count direction control with an enable low feature.

Median Price

$60.474

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10 parts In-Stock

1+ parts

$55.610

100+ parts

$52.270

1k+ parts

$47.270

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10

$55.610

$52.270

$47.270

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DigiKey

USA . 10 parts In-Stock

1+ parts

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10

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Verical

USA . 10 parts In-Stock

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$65.338

1k+ parts

$59.087

10k+ parts

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10

-

$65.338

$59.087

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 28 parts In-Stock

1+ parts

$10.678

100+ parts

$11.212

1k+ parts

$10.572

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28

$10.678

$11.212

$10.572

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DigiKey Marketplace

USA . 10 parts In-Stock

1+ parts

$50.290

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10

$50.290

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Digiode

USA . 1,340 parts In-Stock

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$52.830

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$52.830

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Vyrian

USA . 6,785 parts In-Stock

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6,785

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Resion

USA . 19 parts In-Stock

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Electronic Expediters

USA . 1 parts In-Stock

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1

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Elcom Components

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 157 parts In-Stock

1+ parts

$3.481

100+ parts

-

1k+ parts

$3.342

10k+ parts

$3.342

157

$3.481

-

$3.342

$3.342

Parana Technologies

USA . 820 parts In-Stock

1+ parts

$28.268

100+ parts

-

1k+ parts

$45.586

10k+ parts

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820

$28.268

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$45.586

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DigiPath Technology Company

USA . 1,113 parts In-Stock

1+ parts

$31.127

100+ parts

$28.637

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1,113

$31.127

$28.637

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ChromeModa Solutions

Germany . 1,791 parts In-Stock

1+ parts

$31.762

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$26.045

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1,791

$31.762

$26.045

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IDEA Electronic Components Group

UK . 1,766 parts In-Stock

1+ parts

$31.762

100+ parts

$30.174

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$28.586

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1,766

$31.762

$30.174

$28.586

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Corphita

USA . 1,674 parts In-Stock

1+ parts

$50.049

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1,674

$50.049

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Microchip USA

USA . 926 parts In-Stock

1+ parts

$118.610

100+ parts

$116.550

1k+ parts

$115.520

10k+ parts

$114.490

926

$118.610

$116.550

$115.520

$114.490

QUARKTWIN TECHNOLOGY LTD

USA . 8,079 parts In-Stock

1+ parts

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8,079

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Overview

Elevate your electronic designs with the SNJ54BCT2240J from Texas Instruments. This high-quality bus driver and transceiver offers unmatched reliability and performance, thanks to its MIL-PRF-38535 screening level and ceramic, glass-sealed package body material. Perfect for applications requiring fast signal propagation, this versatile component features 2 functions, 3-state output characteristics, and a wide operating temperature range. Trust in Texas Instruments to deliver cutting-edge technology that meets your design needs with precision and efficiency.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides excellent durability and protection for the internal components of the bus driver and transceivers, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 6.3 ns

The low propagation delay ensures fast signal transmission, making this product ideal for applications requiring quick response times.

No. of Functions: 2

Having multiple functions in one package simplifies the design and integration process, saving space and reducing complexity in the circuit.

Screening Level: MIL-PRF-38535

This screening level ensures that the bus driver and transceivers meet rigorous military specifications for reliability and performance in harsh environments.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes integration with other components and systems straightforward, enhancing compatibility and ease of use.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand extreme conditions without performance degradation, making it suitable for a wide range of applications.

Technical Specifications

Bus Driver & Transceivers SNJ54BCT2240J attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

33 OHM OUTPUT SERIES RESISTOR

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

BCT/FBT

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

Length:

24.195 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

76 mA

Propagation Delay At Nominal Supply:

6.3 ns

Propagation Delay (tpd):

6.3 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.62 mm

Trade Compliance

SNJ54BCT2240J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-413-1022, 5962014131022

NIIN

014131022

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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