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SNJ54AHC373W

Texas Instruments

SNJ54AHC373W by Texas Instruments

SNJ54AHC373W by Texas Instruments is an 8-bit bus driver with a propagation delay of 10.5 ns at 3.3V, suitable for military-grade applications. It features a max operating temperature of 125°C, output polarity TRUE, and a flatpack package style for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,992 parts In-Stock

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Digiode

USA . 4,723 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 244 parts In-Stock

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$3.187

100+ parts

-

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$3.059

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$3.059

244

$3.187

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$3.059

$3.059

AZTECH Wire

Italy . 878 parts In-Stock

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$6.339

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878

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Parana Technologies

USA . 1,416 parts In-Stock

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$13.481

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$13.993

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DigiPath Technology Company

USA . 757 parts In-Stock

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$14.844

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$13.657

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757

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$13.657

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IDEA Electronic Components Group

UK . 2,375 parts In-Stock

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$15.147

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$14.390

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$13.632

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2,375

$15.147

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$13.632

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ChromeModa Solutions

Germany . 1,221 parts In-Stock

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$15.147

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$12.421

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One Stop Electronics

USA . 376 parts In-Stock

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$16.000

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Ampacity Inc.

Singapore . 177 parts In-Stock

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$19.000

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Corphita

USA . 4,934 parts In-Stock

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Microchip USA

USA . 2,338 parts In-Stock

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Overview

Upgrade your electronic designs with the top-quality SNJ54AHC373W bus driver and transceiver from Texas Instruments. This high-performance component offers fast propagation delay, 3-state output characteristics, and a MILITARY-grade screening level, ensuring reliability in demanding applications. With a wide voltage range and low power consumption, this versatile chip is perfect for industrial, automotive, and aerospace projects. Trust Texas Instruments for cutting-edge technology that delivers unmatched value and performance to meet your design needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection to the internal components of the product, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay allows for fast signal transmission, making this product ideal for high-speed communication applications.

Surface Mount: YES

Surface mount technology makes installation easier and more efficient, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into various system designs, maximizing flexibility and compatibility.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a commonly used supply voltage makes this product compatible with a wide range of electronic systems.

Power Supplies (V): 2/5.5

Supporting a range of power supply voltages provides versatility in system design and compatibility with different power sources.

No. of Bits: 8

Having 8 bits allows for a higher data resolution and more precise communication between devices.

Maximum Operating Temperature: 125 °C

Ability to operate at high temperatures ensures reliability and performance in challenging environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SNJ54AHC373W attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-GDFP-F20

JESD-609 Code:

e0

Length:

13.09 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL20,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.45 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.92 mm

Trade Compliance

SNJ54AHC373W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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