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SNJ54AC245W

Texas Instruments

SNJ54AC245W by Texas Instruments

SNJ54AC245W by Texas Instruments is an 8-bit bus driver with a propagation delay of 11.5 ns, suitable for military-grade applications. It operates at a nominal voltage of 3.3V and features a max operating temperature of 125°C. With a flatpack package style and dual terminal position, it offers bidirectional control in a compact form factor for various electronic systems.

Median Price

$8.697

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 1 parts In-Stock

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$8.697

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Vyrian

USA . 5,929 parts In-Stock

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Digiode

USA . 1,076 parts In-Stock

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Electronics Depot

USA . 13 parts In-Stock

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Electro Mavin

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 113 parts In-Stock

1+ parts

$6.659

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$6.393

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113

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$6.393

Parana Technologies

USA . 1,341 parts In-Stock

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$10.740

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$11.224

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AZTECH Wire

Italy . 743 parts In-Stock

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$10.994

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DigiPath Technology Company

USA . 604 parts In-Stock

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$11.826

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ChromeModa Solutions

Germany . 5,183 parts In-Stock

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$12.067

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$9.895

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IDEA Electronic Components Group

UK . 393 parts In-Stock

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$12.067

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$11.464

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$10.860

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One Stop Electronics

USA . 1,410 parts In-Stock

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$51.000

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Corphita

USA . 2,251 parts In-Stock

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Microchip USA

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Overview

Experience seamless data transmission with the Texas Instruments SNJ54AC245W Bus Driver & Transceiver. Manufactured by a trusted industry leader, this high-quality product is designed for reliable performance in a variety of applications. Enjoy fast propagation delays, versatile power supplies, and convenient 3-STATE output characteristics. With a wide temperature range and military-grade screening, this component offers exceptional value and benefits to customers seeking superior connectivity solutions. Trust Texas Instruments for cutting-edge technology that delivers outstanding results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

High-quality material ensures durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 11.5 ns

Fast propagation delay allows for efficient communication within the circuit.

Surface Mount: YES

Easy installation process with surface mount capability.

Package Shape: RECTANGULAR

Compact design saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal voltage supply for reliable performance.

Load Capacitance (CL): 50 pF

Suitable for handling common load capacitances in bus driver applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures in military-grade applications.

Minimum Operating Temperature: -55 °C

Suitable for operation in extreme cold conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Finish: Tin/Lead (Sn/Pb)

Provides a reliable terminal finish for long-lasting connections.

Technical Specifications

Bus Driver & Transceivers SNJ54AC245W attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-GDFP-F20

JESD-609 Code:

e0

Length:

13.09 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL20,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.54 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

6.92 mm

Trade Compliance

SNJ54AC245W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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